Cu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향Effects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloys

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dc.contributor.advisor유진-
dc.contributor.advisorYu, Jin-
dc.contributor.author신승우-
dc.contributor.authorShin, Seung-Woo-
dc.date.accessioned2011-12-15T01:07:29Z-
dc.date.available2011-12-15T01:07:29Z-
dc.date.issued2003-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=231100&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50450-
dc.description학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.8, [ viii, 116 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subjectcreep-
dc.subjectSn-
dc.subjectsolder-
dc.subjectlead-free-
dc.subjectlapshear-
dc.subject랩시어-
dc.subject크리프-
dc.subject주석-
dc.subject솔더-
dc.subject무연-
dc.titleCu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향-
dc.title.alternativeEffects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloys-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN231100/325007 -
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000985196-
dc.contributor.localauthor신승우-
dc.contributor.localauthorShin, Seung-Woo-
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