DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 유진 | - |
dc.contributor.advisor | Yu, Jin | - |
dc.contributor.author | 신승우 | - |
dc.contributor.author | Shin, Seung-Woo | - |
dc.date.accessioned | 2011-12-15T01:07:29Z | - |
dc.date.available | 2011-12-15T01:07:29Z | - |
dc.date.issued | 2003 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=231100&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/50450 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.8, [ viii, 116 p. ] | - |
dc.language | kor | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | creep | - |
dc.subject | Sn | - |
dc.subject | solder | - |
dc.subject | lead-free | - |
dc.subject | lapshear | - |
dc.subject | 랩시어 | - |
dc.subject | 크리프 | - |
dc.subject | 주석 | - |
dc.subject | 솔더 | - |
dc.subject | 무연 | - |
dc.title | Cu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향 | - |
dc.title.alternative | Effects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloys | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 231100/325007 | - |
dc.description.department | 한국과학기술원 : 재료공학과, | - |
dc.identifier.uid | 000985196 | - |
dc.contributor.localauthor | 신승우 | - |
dc.contributor.localauthor | Shin, Seung-Woo | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.