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Showing results 10 to 15 of 15

10
Interfacial characteristics of solder joint in electronic packaging = 전자 패키징 솔더 접합부의 계면 특성 : 그래핀과 플렉시블 기판의 응용link

Ko, Yong-Ho; 고용호; et al, 한국과학기술원, 2017

11
Laser-Induced Hydrothermal Growth of Heterogeneous Metal-Oxide Nanowire on Flexible Substrate by Laser Absorption Layer Design

Yeo, Junyeob; Hong, Sukjoon; Kim, Gunho; Lee, Habeom; Suh, Young Duk; Park, Inkyu; Grigoropoulos, Costas P.; et al, ACS NANO, v.9, no.6, pp.6059 - 6068, 2015-06

12
Mechanical characteristics of metal nanoparticle thin film on flexible substrate exposed to saline solution

Kim, Sang Hyeok; Park, Jaeho; Lee, Jin Jae; Kim, Jae-Hyun; Ryu, Seunghwa; Park, Inkyu, NANOTECHNOLOGY, v.32, no.5, 2021-01

13
Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography

Eom, Hyeonjin; Kim, Jae-Han; Hur, Junyoung; Kim, Taek-Soo; Sung, Sang-Keun; Choi, Jun-Hyuk; Lee, Eungsug; et al, ACS APPLIED MATERIALS INTERFACES, v.7, no.45, pp.25171 - 25179, 2015-11

14
Nonvacuum, Maskless Fabrication of a Flexible Metal Grid Transparent Conductor by Low-Temperature Selective Laser Sintering of Nanoparticle Ink

Hong, Suk-Joon; Yeo, Jun-Yeob; Kim, Gun-Ho; Kim, Dong-Kyu; Lee, Ha-Beom; Kwon, Jin-Hyeong; Lee, Hyung-Man; et al, ACS NANO, v.7, no.6, pp.5024 - 5031, 2013-06

15
연성 기판-유기 경성 기판간의 상온 초음파 ACF 접합 공정에 관한 연구 = Ultrasonic anisotropic conductive films (ACFs) bonding of flexible substrates on organic rigid boards at room temperaturelink

이기원; Lee, Ki-Won; et al, 한국과학기술원, 2007

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