학위논문(박사) - 한국과학기술원 : 기계공학과, 2017.2,[viii, 144 p. :]
electronic packaging; flexible substrate; Pb-free solder; interfacial reaction; intermetallic compound; solder joint; graphene; reliability; 전자 패키징; 유연 기판; 무연 솔더; 계면 반응; 금속간화합물; 솔더 접합부; 그래핀; 신뢰성
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