Browse by Subject COPPER
Showing results 57 to 116 of 233
| Effect of a high angle grain boundary on deformation behavior of Al nanopillars Kim, You Bin; Lee, Subin; Jeon, Jong Bae; Kim, Yong-Jae; Lee, Byeong-Joo; Oh, Sang Ho; Han, Seung Min J., SCRIPTA MATERIALIA, v.107, pp.5 - 9, 2015-10 |
| Effect of nucleation density on the crystallinity of graphene grown from mobile hot-wire-assisted CVD Lee, Eunyoung; Baek, Jinwook; Park, Ji Su; Kim, Jin; Yuk, Jong Min; Jeon, Seokwoo, 2D MATERIALS, v.6, no.1, 2018-10 |
| Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.29, no.10, pp.1207 - 1213, 2000 |
| Effect of Stain Rate on Microstructure Evolution and Compressive Deformation Behavior of High-Strength Aluminum Coating Materials Fabricated by the Kinetic Spray Process Kim, Kyu-Sik; Lee, Changhee; Huh, Hoon; Lee, Kee-Ahn, MATERIALS TRANSACTIONS, v.56, no.4, pp.605 - 609, 2015 |
| EFFECT OF STRESS FREQUENCY ON THE CYCLIC CREEP-BEHAVIOR OF ZIRCALOY-4 IN THE DYNAMIC STRAIN AGING TEMPERATURE-RANGE AHN, JS; Wee, Dang-Moon; NAM, SW, JOURNAL OF NUCLEAR MATERIALS, v.175, no.3, pp.254 - 257, 1990-12 |
| Effect of surface energy on size-dependent deformation twinning of defect-free Au nanowires Hwang, Byungil; Kang, Mijeong; Lee, Subin; Weinberger, Christopher R.; Loya, Phillip; Lou, Jun; Oh, Sang Ho; et al, NANOSCALE, v.7, no.38, pp.15657 - 15664, 2015-10 |
| Effect of Water Vapor on Oxidation Processes of the Cu(111) Surface and Sublayer Kim, Young Jae; Kim, Daeho; Kim, Yongman; Jeong, Yongchan; Jeong, Beomgyun; Park, Jeong Young, INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES, v.24, no.1, 2023-01 |
| Effects of chemical oxidations on the fracture toughness of leadframe/EMC interfaces Lee, HY; Yu, Jin, METALS AND MATERIALS-KOREA, v.5, no.5, pp.471 - 476, 1999-10 |
| Effects of Clioquinol on Metal-Triggered Amyloid-beta Aggregation Revisited Mancino, Allana M.; Hindo, Sarmad S.; Kochi, Akiko; Lim, Mi Hee, INORGANIC CHEMISTRY, v.48, no.20, pp.9596 - 9598, 2009-10 |
| Effects of Cu on the passive film stability of Fe-20Cr-xCu (x=0, 2,4 wt.%) alloys in H2SO4 solution Oh, Kkoch-Nim; Toor, Ihsan-ul-Haq; Ahn, Soo-Hoon; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.88, pp.170 - 176, 2013-01 |
| Effects of Highly Ordered TiO2 Nanotube Substrates on the Nucleation of Cu Electrodeposits Ryu, Won-Hee; Park, Chan-Jin; Kwon, Hyuk-Sang, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.10, pp.3671 - 3675, 2010-05 |
| Effects of mircostructure and crystallographic orientation on the deformation Behavior of Ni/Ni3Al single crystals Song, Seong-Hun; Kishida, Kyosuke; Demura, Masahiko; Hirano, Toshiyuki; Kim, Min-Chul; Oh, Myung-Hoon; Wee, Dang-Moon, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.45, no.2, pp.71 - 79, 2007-02 |
| Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces Lee, H.Y.; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.277, no.1-2, pp.154 - 160, 2000-01 |
| Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering Kim, J. Y.; Yu, Jin, APPLIED PHYSICS LETTERS, v.92, no.9, 2008-03 |
| Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11 |
| Effects of steam addition on the spontaneous activation in Ni3Al foil catalysts during methanol decomposition Jang, Jun Hyuk; Xu, Ya; Chun, Dong Hyun; Demura, Masahiko; Wee, Dang-Moon; Hirano, Toshiyuki, JOURNAL OF MOLECULAR CATALYSIS A-CHEMICAL, v.307, no.1-2, pp.21 - 28, 2009-07 |
| Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries Kim, Ryoung-Hee; Han, Dong-Wook; Nam, Do-Hwan; Kim, Jeong-Han; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.157, no.5, pp.269 - 273, 2010 |
| Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
| Effects of sulphate ion additives on the pitting corrosion of pure aluminium in 0.01 M NaCl solution Lee, WJ; Pyun, Su Il, ELECTROCHIMICA ACTA, v.45, no.12, pp.1901 - 1910, 2000 |
| Efficient preparation of graphene liquid cell utilizing direct transfer with large-area well-stitched graphene Sasaki, Yuki; Kitaura, Ryo; Yuk, Jong Min; Zettl, Alex; Shinohara, Hisanori, CHEMICAL PHYSICS LETTERS, v.650, pp.107 - 112, 2016-04 |
| Electrolyte conditioning for electrokinetic remediation of As, Cu, and Pb-contaminated soil Ryu, Byung-Gon; Park, Geun-Yong; Yang, Ji-Won; Baek, Kitae, SEPARATION AND PURIFICATION TECHNOLOGY, v.79, no.2, pp.170 - 176, 2011-06 |
| Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection Kim, Jungkyun; Rhee, Hakseung; Son, Myeong Won; Park, Juseong; Kim, Gwangmin; Song, Hanchan; Kim, Geunwoo; et al, ACS APPLIED ELECTRONIC MATERIALS, v.5, no.5, pp.2447 - 2453, 2023-04 |
| Energetic polymeric networks prepared via a solvent- and catalyst-free thermal cycloaddition of azide-bearing polymers with alkynes and hydroxyl-isocyanate addition reactions Min, Byoung Sun; Jeon, Heung Bae; Jeong, Tae Uk; Kim, Sang Youl, POLYMER CHEMISTRY, v.6, no.45, pp.7913 - 7920, 2015 |
| Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process Hwang, Jaewon; Yoon, Taeshik; Jin, Sung Hwan; Lee, Jinsup; Kim, Taek-Soo; Hong, Soon-Hyung; Jeon, Seokwoo, ADVANCED MATERIALS, v.25, no.46, pp.6724 - 6729, 2013-12 |
| Enhanced Oxygen Evolution Reaction by Efficient Bubble Dynamics of Aligned Nonoxidized Graphene Aerogels Kim, Jin; Tiwari, Anand P.; Qin, Caiyan; Novak, Travis G.; Lee, Jinho; Kim, Jungmo; Park, Minsu; et al, ACS SUSTAINABLE CHEMISTRY & ENGINEERING, v.9, no.30, pp.10326 - 10334, 2021-08 |
| Enhanced thermoelectric properties of flexible Cu2-xSe (x >= 0.25) NW/polyvinylidene fluoride composite films fabricated via simple mechanical pressing Pammi, S. V. N.; Jella, Venkatraju; Choi, Jin-Seok; Yoon, Soon-Gil, JOURNAL OF MATERIALS CHEMISTRY C, v.5, no.3, pp.763 - 769, 2017-01 |
| Enhancement of the film growth rate by promoting iodine adsorption in the catalyst-enhanced chemical vapor deposition of Cu Kwon, OK; Lee, HB; Kang, Sang-Won; Park, HS, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A, v.20, no.2, pp.408 - 412, 2002 |
| Enhancement of the SO2 Sorption Capacity of CuO/-Al2O3 Sorbent by an Alkali-Salt Promoter Jeong, Sang Mun; Kim, Sang Done, INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, v.36, no.12, pp.5425 - 5431, 1997-08 |
| Enzyme-Free Colorimetric Detection of Cu2+ by Utilizing Target-Triggered DNAzymes and Toehold-Mediated DNA Strand Displacement Events Park, Yeonkyung; Lee, Chang Yeol; Park, Ki Soo; Park, Hyun Gyu, CHEMISTRY-A EUROPEAN JOURNAL, v.23, no.68, pp.17379 - 17383, 2017-12 |
| Equilibrium, kinetic and thermodynamic modeling for the adsorption of heavy metals onto chemically modified hydrotalcite Anirudhan, TS; Suchithra, Padmajan Sasikala, INDIAN JOURNAL OF CHEMICAL TECHNOLOGY, v.17, no.4, pp.247 - 259, 2010-07 |
| Evaluation of tin nitride (Sn3N4) via atomic layer deposition using novel volatile Sn precursors Park, Hyeonbin; Choi, Heenang; Shin, Sunyoung; Park, Bo Keun; Kang, Kibum; Ryu, Ji Yeon; Eom, Taeyong; et al, DALTON TRANSACTIONS, v.52, no.41, pp.15033 - 15042, 2023-10 |
| Excellent strength-ductility combination in nickel-graphite nanoplatelet (GNP/Ni) nanocomposites Borkar, Tushar; Mohseni, Hamidreza; Hwang, Junyeon; Scharf, Thomas W.; Tiley, Jaimie S.; Hong, Soon Hyung; Banerjee, Rajarshi, JOURNAL OF ALLOYS AND COMPOUNDS, v.646, pp.135 - 144, 2015-10 |
| Exploring the reactivity of flavonoid compounds with metal-associated amyloid-beta species He, Xiaoming; Park, Hyun Min; Hyung, Suk-Joon; DeToma, Alaina S.; Kim, Cheal; Ruotolo, Brandon T.; Lim, Mi Hee, DALTON TRANSACTIONS, v.41, no.21, pp.6558 - 6566, 2012-06 |
| EXTRACTION OF PENICILLIN-G FROM SIMULATED MEDIA BY AN EMULSION LIQUID MEMBRANE PROCESS LEE, SC; Lee, Won Kook, JOURNAL OF CHEMICAL TECHNOLOGY AND BIOTECHNOLOGY, v.55, no.3, pp.251 - 261, 1992 |
| Fabrication and characterization of powder metallurgy tantalum components prepared by high compaction pressure technique Kim, Youngmoo; Lee, Dongju; Hwang, Jaewon; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS CHARACTERIZATION, v.114, pp.225 - 233, 2016-04 |
| Fabrication of a smooth, large-grained Cu(In,Ga) Se-2 thin film using a Cu/(In, Ga)(2)Se-3 stacked precursor at low temperature for CIGS solar cells Jung, Gwangsun; Mun, Seonhong; Shin, Dong-Hyeop; Chalapathy, R. B. V.; Ahn, Byung-Tae; Kwon, Hyuk-Sang, RSC ADVANCES, v.5, no.10, pp.7611 - 7618, 2015 |
| Fabrication of CuO-NP-Doped PVDF Composites Based Electrospun Triboelectric Nanogenerators for Wearable and Biomedical Applications Amrutha, Bindhu; Prasad, Gajula; Sathiyanathan, Ponnan; Reza, Mohammad Shamim; Kim, Hongdoo; Pathak, Madhvesh; Prabu, Arun Anand, POLYMERS, v.15, no.11, 2023-05 |
| Facet selectivity of Cu current collector for Li electrodeposition Kim, Yun-Jung; Kwon, Sung Hyun; Noh, Hyungjun; Yuk, Seongmin; Lee, Hongkyung; Jin, Hyun Soo; Lee, Jinhong; et al, Energy Storage Materials, v.19, pp.154 - 162, 2019-05 |
| Feasibility of micellar-enhanced ultrafiltration (MEUF) for the heavy metal removal in soil washing effluent Jung, Juri; Yang, Jung-Seok; Kim, Seong-Hye; Yang, Ji-Won, DESALINATION, v.222, no.1-3, pp.202 - 211, 2008-03 |
| Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
| FLOWER-LIKE CuO NANOSTRUCTURES FOR ENHANCED BOILING Im, Yunhyeok; Dietz, Carter; Lee, Seung Seob; Joshi, Yogendra, NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING, v.16, no.3, pp.145 - 153, 2012 |
| Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution Oh, Se-Kwon; Kim, Youngjun; Jung, Ki Min; Park, Miseok; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.24, no.1, pp.67 - 72, 2018-01 |
| Galvanic Corrosion of Cu Coupled to Au on a Print Circuit Board; Effects of Pretreatment Solution and Etchant Concentration in Organic Solderability Preservatives Soft Etching Solution Oh, Se-Kwon; Kim, YoungJun; Shon, MinYoung; Kwon, Hyuk-Sang, METALS AND MATERIALS INTERNATIONAL, v.22, no.5, pp.781 - 788, 2016-09 |
| GPU-accelerated 3D volumetric X-ray-induced acoustic computed tomography Lee, Donghyun; Park, Eun-Yeong; Choi, Seongwook; Kim, Hyeongsub; Min, Jung-joon; Lee, Changho; Kim, Chulhong, BIOMEDICAL OPTICS EXPRESS, v.11, no.2, pp.752 - 761, 2020-02 |
| Grain boundary faceting and abnormal grain growth in nickel Lee, SB; Hwang, NM; Yoon, Duk-Yong; Henry, MF, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.31, no.3A, pp.985 - 994, 2000-03 |
| Grain-size dependence of plastic deformation in nanocrystalline Fe Jang, D; Atzmon, M, JOURNAL OF APPLIED PHYSICS, v.93, no.11, pp.9282 - 9286, 2003-06 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |
| Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
| Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07 |
| Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films Park, JS; Kang, Sang-Won; Kim, H, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.24, no.3, pp.1327 - 1332, 2006 |
| Growth of graphene on non-catalytic substrate by controlling the vapor pressure of catalytic nickel Baek, Jinwook; Kim, Jungmo; Kim, Jin; Shin, Byungha; Jeon, Seokwoo, CARBON, v.143, pp.294 - 299, 2019-03 |
| H+-Assisted fluorescent differentiation of Cu+ and Cu2+: effect of Al3+-induced acidity on chemical sensing and generation of two novel and independent logic gating pathways Ha, Yong-Hwang; Murale, Dhiraj Padmakar; Yun, Changsuk; Manjare, Sudesh T.; Kim, Hyungjun; Kwak, Ju-Hyoun; Leea, Yoon Sup; et al, CHEMICAL COMMUNICATIONS, v.51, no.29, pp.6357 - 6360, 2015-04 |
| Heavy metals uptake from aqueous solutions and industrial wastewaters by humic acid-immobilized polymer/bentonite composite: Kinetics and equilibrium modeling Anirudhan, TS; Suchithra, Padmajan Sasikala, CHEMICAL ENGINEERING JOURNAL, v.156, no.1, pp.146 - 156, 2010-01 |
| High-performance solution-processable flexible and transparent conducting electrodes with embedded Cu mesh Han, Seolhee; Chae, Yoonjeong; Kim, Ju Young; Jo, Yejin; Lee, Sang Seok; Kim, Shin-Hyun; Woo, Kyoohee; et al, JOURNAL OF MATERIALS CHEMISTRY C, v.6, no.16, pp.4389 - 4395, 2018-04 |
| Highly Efficient and Versatile Pd-Catalyzed Direct Alkynylation of Both Azoles and Azolines Kim, Seok-Hwan; Chang, Suk-Bok, ORGANIC LETTERS, v.12, no.8, pp.1868 - 1871, 2010-04 |
| Highly Enhanced Electromechanical Stability of Large-Area Graphene with Increased Interfacial Adhesion Energy by Electrothermal-Direct Transfer for Transparent Electrodes Kim, Jangheon; Kim, Gi Gyu; Kim, Soohyun; Jung, Wonsuk, ACS APPLIED MATERIALS & INTERFACES, v.8, no.35, pp.23396 - 23403, 2016-09 |
| Highly Selective Fluorescence Detection of Cu(2+) in Water by Chiral Dimeric Zn(2+) Complexes through Direct Displacement Khatua, Snehadrinarayan; Choi, Shin Hei; Lee, Junseong; Huh, Jung Oh; Do, Youngkyu; Churchill, David G, INORGANIC CHEMISTRY, v.48, no.5, pp.1799 - 1799, 2009-03 |
Hot electrons generated by intraband and interband transition detected using a plasmonic Cu/TiO2 nanodiode Lee, Changhwan; Park, Yujin; Park, Jeong Young, RSC ADVANCES, v.9, no.32, pp.18371 - 18376, 2019-06 |
| Image Cytometric Analysis of Algal Spores for Evaluation of Antifouling Activities of Biocidal Agents Koo, Bon Il; Lee, Yun-Soo; Seo, Mintae; Choi, Hyung Seok; Seah, Geok Leng; Nam, Taegu; Nam, Yoon Sung, SCIENTIFIC REPORTS, v.7, pp.6908, 2017-07 |
| Impaired osteogenesis in Menkes disease-derived induced pluripotent stem cells Kim, Dongkyu; Choi, Jieun; Han, Kyu-Min; Lee, Beom Hee; Choi, Jin-Ho; Yoo, Han-Wook; Han, Yong-Mahn, STEM CELL RESEARCH & THERAPY, v.6, 2015-09 |
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- 31,509 2020 - 2024
- 99,997 2010 - 2019
- 75,670 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969