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Showing results 88081 to 88100 of 275955

88081
Fabrication of Tandem-type Vertically Integrated Nanogenerator by In-situ Deposition of AlN/ZnO Films

Yim, Munhyuk; Jeon, Buil; Yoon, Giwan, JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.19, no.2, pp.233 - 238, 2019-04

88082
Fabrication of Tantalum and Nitrogen Codoped ZnO (Ta, N-ZnO) Thin Films Using the Electrospay: Twin Applications as an Excellent Transparent Electrode and a Field Emitter

Khalid, Mahmood; Park, Seung-Bin; Sung, Hyung-Jin, ACS APPLIED MATERIALS & INTERFACES, v.5, no.9, pp.3722 - 3730, 2013-05

88083
Fabrication of terahertz metamaterial with high refractive index using high-resolution electrohydrodynamic jet printing

Yudistira, Hadi Teguh; Tenggara, Ayodya Pradhipta; Vu Dat Nguyen; Kim, Teun Teun; Prasetyo, Fariza Dian; Choi, Choon-gi; Choi, Muhan; et al, APPLIED PHYSICS LETTERS, v.103, no.21, 2013-11

88084
Fabrication of Terfenol-D/Pzt Bilayer Structures for the Study of Voltage Control of Magnetization Easy Axis

Ravindranath, V.; Kim, SH; Jeong, JR; Shin, Sung-Chul, 17th International Conference on Magnetism, 2006-08

88085
Fabrication of TERFENOL-D/PZT bilayer structures for the study of voltage control of magnetization easy axis

Viswan, R; Kim, SH; Jeong, JR; Shin, Sung-Chul, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.310, pp.E899 - E900, 2007-03

88086
Fabrication of textile-based tactile sensors that can be used on both sides

박규순; 스티브 박, 한국고분자학회 2021 추계 학술대회, 한국고분자학회, 2021-10-21

88087
Fabrication of textured YBa2Cu3Ox superconductor using directional growth

No, Kwangsoo; Chung, Dae Shik; Kim, Jae Myung, JOURNAL OF MATERIALS RESEARCH, v.5, no.11, pp.2610 - 2612, 1990-07

88088
fabrication of the alignment layer with cavities by using two dimensional templates of polystyrene latex array

Kim, Jong-Duk, 18th international liquid crystal conference, pp.0 - 0, 2000-07-01

88089
Fabrication of the Colorimetric Thermo-Recorder Using a Polymeric Inverse Opal

이승열; 이준석; Kim, Shin-Hyun, 한국화학공학회 2017년도 봄 총회 및 학술대회, 한국화학공학회, 2017-04-27

88090
Fabrication of the dust mask filter with non-woven electrospun polystyrene nanofibers

유효정; 곽병은; 김도현, 2018 한국유변학회 추계 총회 및 학술발표회, 한국유변학회, 2018-11-16

88091
Fabrication of the Funnel-Shaped Three-Dimensional Plasmonic Tip Arrays by Directional Photofluidization Lithography

Lee, Seung-Woo; Shin, Jong-Hwa; Lee, Yong-Hee; Park, Jung-Ki, ACS NANO, v.4, no.12, pp.7175 - 7184, 2010-12

88092
Fabrication of the hybrid ZnO LED structure grown on p-type GaN by metalorganic chemical vapor deposition

Lee, Jeong Yong, 24th International Conference on Defects in Semiconductors, 2007-07-22

88093
Fabrication of the integrated injection logic by new process = 새로운 제작 방법에 의한 Integrated injection logic 의 제작link

Han, Chul-Hi; 한철희; et al, 한국과학기술원, 1979

88094
Fabrication of the Lotus-like Micro-nanoscale Binary Structured Surface with Superhydrophobicity Induced by Electron Beam Irradiation

Cho, Sung Oh; Li, Y.; Lee, E. J.; Lee, H.M., International Workshop on Accelerator and Beam Utilization, pp.BU-B23 - BU-B23, 2005

88095
Fabrication of the Microchannel by Metal-Organic Framework, Copper Benzenetricarboxylate

임미경; Seo, You-Kyong; Park, Hyoun-Hyang; Kim, Jin-Ha; Chang, Jong-San; Hwang, Young-Kyu; Lee, Seung-Seob, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.4, pp.2714 - 2721, 2013-04

88096
Fabrication of the Microlens-attached AlGaAs/GaAs LED

Kwon, Young Se, International Conference on VLSI and CAD, 1993

88097
Fabrication of the Miniaturized Quasi-monochromatic X-ray Tube based on Carbon Nanotube Field Emitters

Kim, Hyun Jin; Ha, Jun Mok; Ali, Ghafar; Raza, Hamid Saeed; Cho, Sung Oh, OPAP 2013, Global Science and Technology Forum, 2013-02-04

88098
Fabrication of the Packaging-Completed Flexible Electronic Device using Flip Chip Bonding Technology

김도현; 이건재, 2014년 한국고분자학회 춘계학술대회, 한국고분자학회, 2014-04-10

88099
Fabrication of the Packaging-Completed Flexible Electronic Device Using Flip-Chip Bonding Technology

Kim, Do Hyun; Lee, Keon Jae, 2014 MRS Fall Meeting, Materials Research Society, 2014-12-03

88100
Fabrication of the Packaging-Completed Flexible Si-based Device Using Flip-Chip Bonding Technology

Kim, Do Hyun; Yoo, Hyeon Gyun; Lee, Keon Jae, 2015년 대한금속재료학회 추계학술대회, (사)대한금속 재료학회, 2015-10-30

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