88081 | Fabrication of Tandem-type Vertically Integrated Nanogenerator by In-situ Deposition of AlN/ZnO Films Yim, Munhyuk; Jeon, Buil; Yoon, Giwan, JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.19, no.2, pp.233 - 238, 2019-04 |
88082 | Fabrication of Tantalum and Nitrogen Codoped ZnO (Ta, N-ZnO) Thin Films Using the Electrospay: Twin Applications as an Excellent Transparent Electrode and a Field Emitter Khalid, Mahmood; Park, Seung-Bin; Sung, Hyung-Jin, ACS APPLIED MATERIALS & INTERFACES, v.5, no.9, pp.3722 - 3730, 2013-05 |
88083 | Fabrication of terahertz metamaterial with high refractive index using high-resolution electrohydrodynamic jet printing Yudistira, Hadi Teguh; Tenggara, Ayodya Pradhipta; Vu Dat Nguyen; Kim, Teun Teun; Prasetyo, Fariza Dian; Choi, Choon-gi; Choi, Muhan; et al, APPLIED PHYSICS LETTERS, v.103, no.21, 2013-11 |
88084 | Fabrication of Terfenol-D/Pzt Bilayer Structures for the Study of Voltage Control of Magnetization Easy Axis Ravindranath, V.; Kim, SH; Jeong, JR; Shin, Sung-Chul, 17th International Conference on Magnetism, 2006-08 |
88085 | Fabrication of TERFENOL-D/PZT bilayer structures for the study of voltage control of magnetization easy axis Viswan, R; Kim, SH; Jeong, JR; Shin, Sung-Chul, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.310, pp.E899 - E900, 2007-03 |
88086 | Fabrication of textile-based tactile sensors that can be used on both sides 박규순; 스티브 박, 한국고분자학회 2021 추계 학술대회, 한국고분자학회, 2021-10-21 |
88087 | Fabrication of textured YBa2Cu3Ox superconductor using directional growth No, Kwangsoo; Chung, Dae Shik; Kim, Jae Myung, JOURNAL OF MATERIALS RESEARCH, v.5, no.11, pp.2610 - 2612, 1990-07 |
88088 | fabrication of the alignment layer with cavities by using two dimensional templates of polystyrene latex array Kim, Jong-Duk, 18th international liquid crystal conference, pp.0 - 0, 2000-07-01 |
88089 | Fabrication of the Colorimetric Thermo-Recorder Using a Polymeric Inverse Opal 이승열; 이준석; Kim, Shin-Hyun, 한국화학공학회 2017년도 봄 총회 및 학술대회, 한국화학공학회, 2017-04-27 |
88090 | Fabrication of the dust mask filter with non-woven electrospun polystyrene nanofibers 유효정; 곽병은; 김도현, 2018 한국유변학회 추계 총회 및 학술발표회, 한국유변학회, 2018-11-16 |
88091 | Fabrication of the Funnel-Shaped Three-Dimensional Plasmonic Tip Arrays by Directional Photofluidization Lithography Lee, Seung-Woo; Shin, Jong-Hwa; Lee, Yong-Hee; Park, Jung-Ki, ACS NANO, v.4, no.12, pp.7175 - 7184, 2010-12 |
88092 | Fabrication of the hybrid ZnO LED structure grown on p-type GaN by metalorganic chemical vapor deposition Lee, Jeong Yong, 24th International Conference on Defects in Semiconductors, 2007-07-22 |
88093 | Fabrication of the integrated injection logic by new process = 새로운 제작 방법에 의한 Integrated injection logic 의 제작link Han, Chul-Hi; 한철희; et al, 한국과학기술원, 1979 |
88094 | Fabrication of the Lotus-like Micro-nanoscale Binary Structured Surface with Superhydrophobicity Induced by Electron Beam Irradiation Cho, Sung Oh; Li, Y.; Lee, E. J.; Lee, H.M., International Workshop on Accelerator and Beam Utilization, pp.BU-B23 - BU-B23, 2005 |
88095 | Fabrication of the Microchannel by Metal-Organic Framework, Copper Benzenetricarboxylate 임미경; Seo, You-Kyong; Park, Hyoun-Hyang; Kim, Jin-Ha; Chang, Jong-San; Hwang, Young-Kyu; Lee, Seung-Seob, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.4, pp.2714 - 2721, 2013-04 |
88096 | Fabrication of the Microlens-attached AlGaAs/GaAs LED Kwon, Young Se, International Conference on VLSI and CAD, 1993 |
88097 | Fabrication of the Miniaturized Quasi-monochromatic X-ray Tube based on Carbon Nanotube Field Emitters Kim, Hyun Jin; Ha, Jun Mok; Ali, Ghafar; Raza, Hamid Saeed; Cho, Sung Oh, OPAP 2013, Global Science and Technology Forum, 2013-02-04 |
88098 | Fabrication of the Packaging-Completed Flexible Electronic Device using Flip Chip Bonding Technology 김도현; 이건재, 2014년 한국고분자학회 춘계학술대회, 한국고분자학회, 2014-04-10 |
88099 | Fabrication of the Packaging-Completed Flexible Electronic Device Using Flip-Chip Bonding Technology Kim, Do Hyun; Lee, Keon Jae, 2014 MRS Fall Meeting, Materials Research Society, 2014-12-03 |
88100 | Fabrication of the Packaging-Completed Flexible Si-based Device Using Flip-Chip Bonding Technology Kim, Do Hyun; Yoo, Hyeon Gyun; Lee, Keon Jae, 2015년 대한금속재료학회 추계학술대회, (사)대한금속 재료학회, 2015-10-30 |