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Showing results 72021 to 72040 of 278042

72021
Effect of Eddy on CHF Characteristics with Suddenly Expanded Flow Channel

KIM, YONG JIN; Song, Sub Lee; 문상기; Chang, Soon-Heung; Jeong, Yong-Hoon, The Ninth Korea-Japan Symposium on Nuclear Thermal Hydraulics and Safety (NTHAS9), Thermal Hydraulics Divisions of AESJ, KNS, 2014-11-18

72022
Effect of edges on the stability and magnetic interaction of Co atoms embedded in zigzag graphene nanoribbons

Lee, Alex Taekyung; Chang, Kee-Joo, PHYSICAL REVIEW B, v.87, no.8, pp.085435, 2013-02

72023
Effect of effective areas on ionic conductivity in dense composite material composed of ionic and electronic conductors for solid oxide fuel cells

Lee, Changbo; Bae, Joongmyeon, SOLID STATE IONICS, v.179, no.35-36, pp.2031 - 2036, 2008-10

72024
Effect of EGF on network spiking activity from cultured hippocampal neurons

Kim, Daejeong; Lee, Jee Woong; Nam, Yoonkey, 2016 BMES Annual Meeting, Biomedical Engineering Society, 2016-10-06

72025
Effect of EGR on Combustion Development in a 1.9L DI Diesel Optical Engine

Bae, Choongsik, JOURNAL OF ENGINES, v.104, no.3, pp.1491 - 1515, 1996-01

72026
Effect of EGR on Combustion in a High Speed Direct-Injection Diesel Engine

Bae, Choongsik, Proc. UK-Korea Joint Seminar on IC Engines, pp.173 - 194, 1998-11-01

72027
Effect of elastic interaction energy on coarsening of gamma precipitates in a mechanically alloyed ODS Ni-base superalloy

Ryu, Ho Jin; Hong, Soon-Hyung; Weber, J; Tundermann, JH, JOURNAL OF MATERIALS SCIENCE, v.34, no.2, pp.329 - 336, 1999-01

72028
Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints

Kwon, YM; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19

72029
Effect of Electric Field on Gas Hydrate Nucleation Kinetics: Evidence for the Enhanced Kinetics of Hydrate Nucleation by Negatively Charged Clay Surfaces

Park, Taehyung; Kwon, Tae-Hyuk, ENVIRONMENTAL SCIENCE & TECHNOLOGY, v.52, no.5, pp.3267 - 3274, 2018-03

72030
Effect of electric field on primary dark pulses in SPADs for advanced radiation detection applications

Lim, Kyung Taek; Kim, Hyoungtaek; Kim, Jinhwan; Cho, Gyuseong, NUCLEAR ENGINEERING AND TECHNOLOGY, v.53, no.2, pp.618 - 625, 2021-02

72031
Effect of electric field on silicon photomultipliers for scintillation detector applications = 섬광검출기 활용을 위한 실리콘 광증배소자 내부 전계 영향 연구link

Lim, Kyung Taek; Cho, Gyuseong; et al, 한국과학기술원, 2019

72032
Effect of electric field on the electronic structures of carbon nanotubes

Kim, C; Kim, Bongsoo; Lee, SM; Jo, C; Lee, YH, APPLIED PHYSICS LETTERS, v.79, no.8, pp.1187 - 1189, 2001-08

72033
Effect of electric field on the phase transition in ZrTiO4 ceramic

Park, Y; Lee, HM; Kim, Ho Gi, JOURNAL OF APPLIED PHYSICS, v.82, pp.1491 - 1493, 1997-08

72034
Effect of electrical annealing on the luminous efficiency of thermally annealed polymer light-emitting diodes

Lee, TW; Park, OOk, APPLIED PHYSICS LETTERS, v.77, no.21, pp.3334 - 3336, 2000-11

72035
Effect of Electrode Geometries on Laboratory Electrical Resistivity Measurement

Hong, Chang-Ho; Chong, Song-Hun; Cho, Gye-Chun, 32nd KKHTCNN Symposium on Civil Engineering, KAIST, 2019-10-24

72036
Effect of electrode material on the electrochemical reduction of nitrogen in a molten LiCl-KCl-CsCl system

Kim, Kwi Yong; Kim, Jong-Nam; Yoon, Hyung Chul; Han, Jong-In, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.40, no.16, pp.5578 - 5582, 2015-05

72037
Effect of electrode materials on the exchange current density using Tafel measurement

임근홍; 윤종일, 2018 한국방사성폐기물학회 추계학술발표회, Korean Radioactive Waste Society, 2018-11-01

72038
Effect of electrode parameters on charge performance of a lead-acid cell

Kim, SC; Hong, Won-Hi, JOURNAL OF POWER SOURCES, v.89, no.1, pp.15 - 28, 2000-07

72039
Effect of electrode parameters on charge performance of a lead–acid cell

Kim, Sung Chul; Hong, Won Hi, Journal of Power Sources 89(2000)15–28, 2000-07

72040
Effect of electrodeposition conditions on Kirkendall void formation between electrodeposited Cu film and Sn-3.5Ag solder

Kim, JY; Yu, Jin; Lee, TY, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1620 - 1625, 2007-05-29

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