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Showing results 33061 to 33080 of 276631

33061
Assembly of randomly grown ZnO nanowires by transfer printing using polymer substrate

박인규; 이지혜; 이원석, 2011 한국고분자학회 춘계 학술대회, 한국고분자학회, 2011-04

33062
Assembly of SnO2 Rod using Optical Tweezers and Laser Curing of Metal Nanoparticles

Nam, Chanhyuk; Hong, Daehie; Chung, Jaeik; Hwang, Insung; Lee, Jongheun; Ko, Seung Hwan; Grigoropoulos, Costas P.; et al, Japanese Journal of Applied Physics, Vol.49, pp.05EA12, 2010-05-20

33063
Assembly of Sub-10-nm Block Copolymer Patterns with Mixed Morphology and Period Using Electron Irradiation and Solvent Annealing

Son, Jeong Gon; Chang, Jae-Byum; Berggren, Karl K.; Ross, Caroline A., NANO LETTERS, v.11, no.11, pp.5079 - 5084, 2011-11

33064
Assembly of Thiosubstituted Benzoxazoles via Copper-Catalyzed Coupling of Thiols with 5-Iodotriazoles Serving as Diazo Surrogates

Kotovshchikov Y.N.; Latyshev G.V.; Kirillova E.A.; Moskalenko, Uliana D,; Lukashev N.V.; Beletskaya I.P., Journal of Organic Chemistry, v.85, no.14, pp.9015 - 9028, 2020-07

33065
Assembly performance of a robotic vibratory wrist

Cho, Hyungsuck, IFAC Symposium on Information Control Problems in Manufacturing Technology, Madrid, Spain, 1989

33066
Assembly scheduling subject to outsourced-component available time constraints = 외주부품 조달시간제약을 고려한 조립 일정계획 연구link

Juhn, Jae-Ho; 전재호; Lee, Tae-Eog; 이태억; et al, 한국과학기술원, 2009

33067
Assembly solving for neutral re-imported product models

Jauhar, Tahir A.; Han, Soonhung; Kwon, Soonjo, Computer-Aided Design and Applications, v.17, no.1, pp.108 - 123, 2020

33068
Assembly Structure of Collagen and Actin Protein Fibers Inside and Outside Vesicles

최명철; 박수진; 송채연; 신관우, 한국고분자학회, 한국고분자학회, 2013-10-10

33069
Assembly structures of microtubules and polylysine using small angle scattering and TEM = Microtubules와 Polylysine의 Assembly 구조에 관한 Small Angle Scattering 및 TEM 연구link

Lee, Juncheol; 이준철; et al, 한국과학기술원, 2015

33070
Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07

33071
Assertion 기법을 소프트웨어 요구 분석에 적용하기 위한 연구 = A study on application of the assertion techniques to analysis of software requirementslink

차신; Cha, Shin; et al, 한국과학기술원, 1987

33072
Assertion 기법의 소프트웨어 요구분석 과정에의 응용 연구

권용래, 한국정보과학회 학술발표논문집 제 1 4권 1호, 1987

33073
Assesment and Improvement of Condensation Models in RELAP5/MOD3.2

No, Hee Cheon; Choi, Ki Yong; Park, Hyun Sik; Kim, Sang Jae, 한국원자력학회 추계발표회, pp.585 - 590, 한국원자력학회, 1997

33074
Assesment on Toxicity of Radioactive Wastes from PEACER in Korea

Lee, Kun Jai, Global 2003, 2003

33075
Assessement of HTGR He Compressor Analysis Tool based on Newton-Raphson Numerical Application to Throughflow Analysis

No, Hee Cheon; Kim, JH; Kim, HM, ICONE14 Int. Conf. on Nuclear Eng., 2006

33076
Assessement of soil-water interaction characteristics using wave-based techniques

Cho, Gye-Chun; Choi, Jun-Su; Song, Ki-Il, The Fifth Korea-Japan Workshop on System Identification and Structural Health Monitoring, 2004-01-30

33077
Assessing 4D-VAR for dynamical mapping of coastal high-frequency radar in San Diego

Hoteit, I.; Cornuelle, B.; Kim, Sung Yong; Forget, G.; Koehl, A.; Terrill, E., DYNAMICS OF ATMOSPHERES AND OCEANS, v.48, no.1-3, pp.175 - 197, 2009-10

33078
Assessing and Managing an Organization's Green IT Maturity

Park, Sang Hyun; Eo, Jaekyung; Lee, Joosung J, MIS QUARTERLY EXECUTIVE, v.11, no.3, pp.127 - 140, 2012-09

33079
Assessing and Restructuring of Classes Based on Cohesion

Chae, Heung Seok; Kwon, Yong Rae, Asia-Pacific Software Engineering Conference, pp.76 - 82, IEEE, 1996-12

33080
Assessing Atherosclerotic Plaque using Precision-enhanced Fluorescence Lifetime Imaging Microscopy

한정무; 김선원; 김현정; 남형수; 송준우; 김진원; 유홍기, Annual Biophotonics Conference 2019, 한국광학회 바이오포토닉스 분과, 2019-11-01

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