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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| School of Electronic and Electrical Engineering Hongik University, Seoul, Korea Kim, Dong-Chan; Park, Seong-Jin; Park, Seong-Ook, 2018 International Symposium on Antennas and Propagation, ISAP 2018, Institute of Electrical and Electronics Engineers Inc., 2018-10 | |
| Opportunity of Metallic Glass in Soft Electronics Jung, Minhyun; Kim, Dongseuk; Kim, Kyungkwan; Yun, Changjin; Rhie, Kungwon; Jeon, Sanghun, 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-07 | |
| Study on electrical characteristics for active die embedding substrate Kim, Hyunho, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, pp.204 - 208, Institute of Electrical and Electronics Engineers Inc., 2014-12 | |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; Kim, Hyesoo; Kim, Joungho; Bae, Michael, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer Lee, Hyunsuk; Kim, Hee-Gon; Kim, Kiyeong; Jung, Daniel Hyunsuk; Kim, Jonghoon J; Choi, Sumin; Lim, Jaemin; Kim, Joungho; Kim, Hyungsoo; Park, Kunwoo, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.850 - 854, Institute of Electrical and Electronics Engineers Inc., 2014-08 | |
| Design Considerations and Performance Trade-Offs for 56Gb/s Discrete Multi-Tone Electrical Link Kim, Gain; Kwon, Woohyun; Toifl, Thomas; Leblebici, Yusuf; Bae, Hyeon-Min, 62nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2019, pp.1147 - 1150, Institute of Electrical and Electronics Engineers Inc., 2019-08-04 | |
| Low-Complexity Nonlinear Electrical Equalization for Directly Modulated Laser-based Transmission Systems Yu, Yukui; Kim, Hoon, 2021 Opto-Electronics and Communications Conference, OECC 2021, Institute of Electrical and Electronics Engineers Inc., 2021-07 | |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; Lee, Jaehak; Song, Junyeop, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Implantable Neural-Recording Modules for Monitoring Electrical Neural Activity in the Central and Peripheral Nervous Systems Lee, Taeju; Choi, Wonsuk; Kim, Jinseok; Je, Minkyu, 63rd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2020, pp.533 - 536, Institute of Electrical and Electronics Engineers Inc., 2020-08 | |
| Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip in Flex) package for wearable electronics applications Paik, Kyung-Wook; Kim, Jihye; Kim, Young R, Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Institute of Electrical and Electronics Engineers Inc., 2016-01 |
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