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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Journal Papers(저널논문)

Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads

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Publisher
한국마이크로전자 및 패키징학회
Issue Date
2006-01
Language
English
Citation

JOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY, v.13, no.1, pp.63 - 72

ISSN
1226-9360
URI
http://hdl.handle.net/10203/88988
Appears in Collection
ME-Journal Papers(저널논문)
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