Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이순복 | ko |
| dc.date.accessioned | 2013-03-07T00:48:27Z | - |
| dc.date.available | 2013-03-07T00:48:27Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-01 | - |
| dc.identifier.citation | JOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY, v.13, no.1, pp.63 - 72 | - |
| dc.identifier.issn | 1226-9360 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/88988 | - |
| dc.language | English | - |
| dc.publisher | 한국마이크로전자 및 패키징학회 | - |
| dc.title | Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 13 | - |
| dc.citation.issue | 1 | - |
| dc.citation.beginningpage | 63 | - |
| dc.citation.endingpage | 72 | - |
| dc.citation.publicationname | JOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY | - |
| dc.contributor.localauthor | 이순복 | - |
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