Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 267
  • Download : 0
DC FieldValueLanguage
dc.contributor.author이순복ko
dc.date.accessioned2013-03-07T00:48:27Z-
dc.date.available2013-03-07T00:48:27Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-01-
dc.identifier.citationJOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY, v.13, no.1, pp.63 - 72-
dc.identifier.issn1226-9360-
dc.identifier.urihttp://hdl.handle.net/10203/88988-
dc.languageEnglish-
dc.publisher한국마이크로전자 및 패키징학회-
dc.titleReliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume13-
dc.citation.issue1-
dc.citation.beginningpage63-
dc.citation.endingpage72-
dc.citation.publicationnameJOURNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY-
dc.contributor.localauthor이순복-
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0