레이저 간섭재(ESPI)에 의해 측정된 플립칩 열변형의 유한요소해석 모델링을 통한 솔더볼의 유동곡선 평가Determination of Flow Curve for Flip-chip Solder Balls Based on FE Modeling of Thermal Displacements Measured by ESPI
- Publisher
- 대한금속·재료학회
- Issue Date
- 2003-06
- Language
- Korean
- Citation
대한금속·재료학회지, v.41, no.6, pp.369 - 376
- ISSN
- 1738-8228
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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