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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword

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Lucas, JP / Chada, S / Kang, SK / Kao, CR / Lin, KL / Ready, J / Yu, Jinresearcher
Publisher
MINERALS METALS MATERIALS SOC
Issue Date
2003-12
Language
English
Article Type
Editorial Material
Citation

JOURNAL OF ELECTRONIC MATERIALS, v.32, no.12, pp.1359 - 1359

ISSN
0361-5235
URI
http://hdl.handle.net/10203/82053
Appears in Collection
MS-Journal Papers(저널논문)
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