DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lucas, JP | ko |
dc.contributor.author | Chada, S | ko |
dc.contributor.author | Kang, SK | ko |
dc.contributor.author | Kao, CR | ko |
dc.contributor.author | Lin, KL | ko |
dc.contributor.author | Ready, J | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2013-03-04T07:47:22Z | - |
dc.date.available | 2013-03-04T07:47:22Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-12 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.32, no.12, pp.1359 - 1359 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/82053 | - |
dc.language | English | - |
dc.publisher | MINERALS METALS MATERIALS SOC | - |
dc.title | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | - |
dc.type | Article | - |
dc.identifier.wosid | 000187885200001 | - |
dc.identifier.scopusid | 2-s2.0-0942288665 | - |
dc.type.rims | ART | - |
dc.citation.volume | 32 | - |
dc.citation.issue | 12 | - |
dc.citation.beginningpage | 1359 | - |
dc.citation.endingpage | 1359 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Lucas, JP | - |
dc.contributor.nonIdAuthor | Chada, S | - |
dc.contributor.nonIdAuthor | Kang, SK | - |
dc.contributor.nonIdAuthor | Kao, CR | - |
dc.contributor.nonIdAuthor | Lin, KL | - |
dc.contributor.nonIdAuthor | Ready, J | - |
dc.type.journalArticle | Editorial Material | - |
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