Sn-Ag 범프의 조성과 표면 형상에 영향을 미치는 도금 인자들에 관한 연구The Effect of Electroplating Parameters on the Compositionsand Morphologies of Sn-Ag Bumps
- Publisher
- 한국마이크로전자및패키징학회
- Issue Date
- 2003-12
- Language
- Korean
- Citation
마이크로전자 및 패키징학회지, v.10, no.4, pp.73 - 79
- ISSN
- 1226-9360
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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