Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)
- Publisher
- AMER INST PHYSICS
- Issue Date
- 2001-11
- Language
- English
- Article Type
- Article
- Keywords
COPPER-FILMS; CARRIER-GAS; METALLIZATION; RESISTIVITY; TEMPERATURE; MORPHOLOGY; PRESSURE; GROWTH; VINYLTRIMETHYLSILANE; INTERCONNECTS
- Citation
JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978
- ISSN
- 0734-2101
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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