DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, WH | ko |
dc.contributor.author | Ko, YK | ko |
dc.contributor.author | Byun, IJ | ko |
dc.contributor.author | Seo, BS | ko |
dc.contributor.author | Lee, JG | ko |
dc.contributor.author | Reucroft, PJ | ko |
dc.contributor.author | Lee, JU | ko |
dc.contributor.author | Lee, JeongYong | ko |
dc.date.accessioned | 2013-03-03T13:35:25Z | - |
dc.date.available | 2013-03-03T13:35:25Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-11 | - |
dc.identifier.citation | JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978 | - |
dc.identifier.issn | 0734-2101 | - |
dc.identifier.uri | http://hdl.handle.net/10203/78896 | - |
dc.language | English | - |
dc.publisher | AMER INST PHYSICS | - |
dc.subject | COPPER-FILMS | - |
dc.subject | CARRIER-GAS | - |
dc.subject | METALLIZATION | - |
dc.subject | RESISTIVITY | - |
dc.subject | TEMPERATURE | - |
dc.subject | MORPHOLOGY | - |
dc.subject | PRESSURE | - |
dc.subject | GROWTH | - |
dc.subject | VINYLTRIMETHYLSILANE | - |
dc.subject | INTERCONNECTS | - |
dc.title | Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) | - |
dc.type | Article | - |
dc.identifier.wosid | 000172466300040 | - |
dc.identifier.scopusid | 2-s2.0-0035509139 | - |
dc.type.rims | ART | - |
dc.citation.volume | 19 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 2974 | - |
dc.citation.endingpage | 2978 | - |
dc.citation.publicationname | JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS | - |
dc.contributor.localauthor | Lee, JeongYong | - |
dc.contributor.nonIdAuthor | Lee, WH | - |
dc.contributor.nonIdAuthor | Ko, YK | - |
dc.contributor.nonIdAuthor | Byun, IJ | - |
dc.contributor.nonIdAuthor | Seo, BS | - |
dc.contributor.nonIdAuthor | Lee, JG | - |
dc.contributor.nonIdAuthor | Reucroft, PJ | - |
dc.contributor.nonIdAuthor | Lee, JU | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | COPPER-FILMS | - |
dc.subject.keywordPlus | CARRIER-GAS | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordPlus | RESISTIVITY | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | MORPHOLOGY | - |
dc.subject.keywordPlus | PRESSURE | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | VINYLTRIMETHYLSILANE | - |
dc.subject.keywordPlus | INTERCONNECTS | - |
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