High-quality epitaxial growth of in situ phosphorus-doped Si films by promoting dispersion of native oxides in alpha-Si

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Two-step growth in reduced pressure chemical vapor deposition has been successfully developed to achieve in situ phosphorus-doped silicon epitaxial layers, and the characteristic evolution of their microstructures has been investigated using scanning electron microscopy, transmission electron microscopy, and secondary ion mass spectroscopy. The two-step growth, which employs crystallization of amorphous silicon (alpha-Si) layer grown at low temperature, offers crucial advantages in manipulating crystal structures of in situ phosphorus-doped silicon. Our experimental results suggest that an epitaxial or polycrystalline film is readily obtained by initiating growth either without or with annealing to crystallize the ct-Si layers. Kinetic processes for crystallization were accompanied by stimulated dispersion of native oxides in alpha-Si buffers. We also observed that a high phosphorus doping level plays an important role in promoting the dispersion of native oxides, and that the shape of doping profiles depends upon the evolution of crystal structures with V-shaped defects. Thus, the phosphorus doping concentration remains uniform in high-quality single-crystalline Si films obtained by the two-step growth. (C) 2000 Elsevier Science B.V. All rights reserved.
Publisher
ELSEVIER SCIENCE BV
Issue Date
2000-05
Language
English
Article Type
Article
Keywords

INTERFACIAL OXIDE; LOW-PRESSURE; SILICON

Citation

JOURNAL OF CRYSTAL GROWTH, v.212, no.3-4, pp.423 - 428

ISSN
0022-0248
URI
http://hdl.handle.net/10203/77904
Appears in Collection
MS-Journal Papers(저널논문)
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