실리콘 마이크로 머시닝을 위한 자기 정렬 특성을 갖는 새로운 실리콘 식각방법과 식각특성분석A Method to Etch Through Silicon With Self-Aligned Property for Silicon Micromachining and Characterization of its Etching Mechanism
- Publisher
- 대한전기학회
- Issue Date
- 1996-10
- Language
- Korean
- Citation
전기학회논문지, v.45, no.10, pp.1433 - 1438
- ISSN
- 1340-5551
- Appears in Collection
- RIMS Journal Papers
- Files in This Item
- There are no files associated with this item.
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