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Showing results 1 to 8 of 8

1
A Brownian dynamics simulation method for analyzing particle behavior in nonuniform and alternating electric fields

Choi, Jin Young; Park, Seok Joo; Kim, Sang Soo, JOURNAL OF AEROSOL SCIENCE, v.38, no.2, pp.192 - 210, 2007-02

2
A new type groove for hydraulic spool valve

Hong, Sung Ho; Kim, Kyung-Woong, TRIBOLOGY INTERNATIONAL, v.103, pp.629 - 640, 2016-11

3
Effect of substrate temperature on the texture and structure of polycrystalline Si0.7Ge0.3 films deposited on SiO2 by molecular beam deposition

Kim, HS; Lee, JeongYong, THIN SOLID FILMS, v.350, no.1-2, pp.14 - 20, 1999-08

4
Effects of thermal and chemical surface-flame interaction on flame quenching

Kim, Kyu Tae; Lee, Dae Hoon; Kwon, Sejin, COMBUSTION AND FLAME, v.146, no.1-2, pp.19 - 28, 2006-07

5
High-quality epitaxial growth of in situ phosphorus-doped Si films by promoting dispersion of native oxides in alpha-Si

Kim, HS; Shim, KH; Lee, SY; Lee, JeongYong; Kang, JY, JOURNAL OF CRYSTAL GROWTH, v.212, no.3-4, pp.423 - 428, 2000-05

6
Improvement of the subcooled boiling model using a new net vapor generation correlation inferred from artificial neural networks to predict the void fraction profiles in the vertical channel

Lee, Taebeom; Jeong, Yong Hoon, NUCLEAR ENGINEERING AND TECHNOLOGY, v.54, no.12, pp.4776 - 4797, 2022-12

7
Improvements in predicting void fraction in subcooled boiling

Ha, KS; Lee, YB; No, Hee Cheon, NUCLEAR TECHNOLOGY, v.150, no.3, pp.283 - 292, 2005-06

8
NEW METHOD TO IMPROVE THERMAL-STABILITY IN THE INTERFACE OF SILICON AND TUNGSTEN BY THE INTERPOSITION OF PLASMA-DEPOSITED TUNGSTEN NITRIDE THIN-FILM

LEE, CW; KIM, YT; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.64, no.5, pp.619 - 621, 1994-01

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