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Showing results 1 to 3 of 3

1
Design of toroidal current probe embedded in multi-layer printed circuit boards for electrostatic discharge(ESD) detection

Sung, H.; Song, E.; Kim, M.; Shim, Y.; Kong, S.; Kwon, J.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07

2
Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs)

Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08

3
Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP)

Kim, M.; Yoon, C.; Koo, K.; Hwang, C.; Sung, H.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.28 - 31, IEEE, 2010-07-25

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