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Showing results 1 to 3 of 3

1
Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath

Suh, MS; Park, CJ; Kwon, Hyuk-Sang, SURFACE & COATINGS TECHNOLOGY, v.200, pp.3527 - 3532, 2006-03

2
Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending

Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10

3
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

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