Browse "College of Engineering(공과대학)" by Author Shim, Hye Rin
Showing results 1 to 4 of 4
| A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress Park, Yong Cheon; Kim, Taehyun; Shim, Hye Rin; Choi, YoungWoo; Hong, Seungbum; Yoo, Seunghyup; Im, Sung Gap, APPLIED SURFACE SCIENCE, v.598, 2022-10 |
| A Solvent-Free, Thermally Curable Low-Temperature Organic Planarization Layer for Thin Film Encapsulation Park, Yong Cheon; Shim, Hye Rin; Jeong, Kihoon; Im, Sung Gap, SMALL, v.19, no.10, 2023-03 |
| Development of organic planarization process and material via initiated chemical vapor deposition process = 개시제를 이용한 화학 기상 증착 공정을 이용한 유기 평탄화 공정 및 물질 연구link Shim, Hye Rin; Im, Sung Gap; et al, 한국과학기술원, 2021 |
Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles Jeong, So Yeong; Shim, Hye Rin; Na, Yunha; Kang, Ki Suk; Jeon, Yongmin; Choi, Seungyeop; Jeong, Eun Gyo; et al, NPJ FLEXIBLE ELECTRONICS, v.5, no.1, pp.15, 2021-07 |
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