Browse "College of Engineering(공과대학)" by Author Pak, Jun-So
Showing results 1 to 14 of 14
| An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor Hwang, Chul-Soon; Shim, Yu-Jeong; Koo, Kyoung-Choul; Kim, Myung-Hoi; Pak, Jun-So; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.8, pp.439 - 441, 2011-08 |
| Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method Kim, Jae-Min; Lee, Woo-Jin; Shim, Yu-Jeong; Shim, Jong-Joo; Kim, Ki-Yeong; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.647 - 659, 2010-08 |
| Co-modeling, experimental verification, and analysis of chip-package hierarchical power distribution network Park, Hyun-Jeong; Kim, Hyung-Soo; Pak, Jun-So; Yoon, Chang-Wook; Koo, Kyoung-Choul; Kim, Joung-Ho, IEICE TRANSACTIONS ON ELECTRONICS, v.E91C, pp.595 - 606, 2008-04 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Young; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08 |
| Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12 |
| Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08 |
| Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package Shim, Yu-Jeong; Park, Jong-Bae; Kim, Jae-Min; Song, Eak-Hwan; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.51, no.3, pp.763 - 773, 2009-08 |
| Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
| Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis Kim, Ga-Won; Kam, Dong-Gun; Lee, Seung-Jae; Kim, Jae-Min; Ha, Myun-Hyun; Koo, Kyoung-Choul; Pak, Jun-So; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.56, pp.1962 - 1972, 2008-08 |
| PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Young; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02 |
| Prediction and verification of power/ground plane edge radiation excited by vias based on balanced TLM and Via coupling model = 대칭형 전송선 방법 및 비아 연결 모델을 이용하여 비아에 의해 유기된 파워/그라운드 판 테두리 방사현상에 대한 예측과 검증link Pak, Jun-So; 박준서; et al, 한국과학기술원, 2005 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04 |
Discover
Open Access
Date issued
- 23,134 2020 - 2024
- 75,382 2010 - 2019
- 57,250 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989