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Showing results 1 to 6 of 6

1
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06

2
Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

Jeon, YD; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208, IEEE, 2003-05-27

3
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01

4
Formation and Characterization of Co-Reinforced Sn-3.5Ag Solder

Jeon, Duk Young; Lee, JS; Chu, KM; Patzelt, R; Manessis, D; Ostmann, A, KAIST/GIST/Postech/Kyoto/Tohoku Univ. Joint Symposium, 2006

5
Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Lee, JS; Chu, KM; Jeon, Duk Young; Patzelt, R; Manessis, D; Ostmann, A, IEEE 56th Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2006-05-30

6
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

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