Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs
- Publisher
- IEEE
- Issue Date
- 2003-05-27
- Language
- English
- Citation
53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
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