Browse "College of Engineering(공과대학)" by Type Conference
Showing results 69801 to 69820 of 91048
| Thermal conductivity of hydrate-bearing sediments in the Ulleung basin Kwon, Tae-Hyuk; Kim, AR; Chang, I; Cho, GC; Lee, JH, The 22th KKCNN Symposium on Civil engineering, Chulalongkorn University, 2009-12 |
| Thermal conductivity of ultrathin Si films with a periodic pore pattern Oh, Jung Hyun; Choi, Won Chul; Jang, Moon Kyu; Shin, Mincheol, 17th International Workshop on Computational Electronics, IWCE 2014, 2014-06-06 |
| Thermal coupling of HTGRs and MED desalination plants, and its performance and cost analysis for nuclear desalination Kim, Ho Sik; No, Hee Cheon, Barcelona 2012, 2012-04 |
| Thermal crack initiation mechanism at high alloy steel slab with phase transformation Lee, Yong Seok; Kim, Seong-Woo; Lee, Soon-Bok, Fatigue 2014 (11th International fatigue congress), Fatigue 2014, 2014-03-04 |
| Thermal crack initiation of high alloy steel slab after continuous casting process through finite element analysis Lee, Yong Seok; Kim, Seong Woo; Lee, You Ho; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| THERMAL CREEP CORRELATIONS OF FERRITIC/MARTENSITIC STEELS FOR ADVANCED NUCLEAR REACTORS Ryu, Ho Jin; Kim, YS; Yacout, AM; Hofman, GL, The Sixth Pacific Rim International Conference on Advanced Materials and Processing, PRICM, 2007-11 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal deactivation of MgCl2/THF/TiCl4 bimetallic complex catalyst in ethylene polymerization Choi, HG; Woo, Seong-Ihl, 2nd EurAsia Conf. on Chemistry, pp.391 - 392, 1990 |
| Thermal Decomposition Kinetics of AUC 김상돈, Proc. of Korea Nuclear Energy Society Autumn Annual Meeting, 1990 |
| Thermal decomposition of Ru(EtCp)2 and metallorganic chemical vapor deposition of Ruthenium thin films using Ru(EtCp)2 No, Kwangsoo; Choi, Jong Wan; Hong, Jong In; Heo, Jung Shik; Moon, Sang Heup, 203rd Meeting of The Electrochemical Society, v.0, no.0, pp.0 - 0, ECS, 2003-04-28 |
| Thermal decomposition 방법을 이용한 AgCu 2원계 나노입자의 합성과 물성평가 김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 춘계학술대회, 2012-04-27 |
| Thermal decomposition 방법을 이용한 Cu2O 나노입자의 합성과 밴드갭 에너지 변화측정 김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 추계 학술대회, 대한금속재료학회, 2012-10-25 |
| Thermal Deformation and Decomposition of Dye and Polycarbonate in Compact Disc-Recordables. Kim, Sung Chul, Pacific Polymer Conference, 1997 |
| Thermal Deformations of CSP Assembly during Temperature Cycling and Power Cycling Ham, SJ; Lee, Soon-Bok, Int. symposium on Electronic Materials and Packaging, Serial 11, pp.350 - 357, IEEE, 2000-11 |
| Thermal Degradation Mechanism of PTFE Jun, HS; Woo, Seong-Ihl; Park, KY, 1987 한국고분자학회 추계학술발표회, 한국고분자학회, 1987-10 |
| Thermal degradation of blue-emitting BaMgAl10O17:Eu2+ phosphors for PDP applications 전덕영, 한국세라믹학회 추계학술대회, pp.119 -, 한국세라믹학회, 2001-10-19 |
| Thermal design of the conduction-cooled AC high temperature superconducting magnet below 10 K Kwon, Dohoon; Kim, Bokeum; Jeong, Sangkwon, Applied Superconductivity Conference 2022, IEEE Council on Superconductivity, 2022-10-24 |
| Thermal effects on interconnect crosstalk of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Nakarmi, Bikash; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, SPIE/COS Photonics Asia 2012, The International Society for Optical Engineering, Chinese Optical Society, 2012-11-07 |
| Thermal effects on modal properties and frequency-based damage detection in plate-girder bridges Kim, JT; Yun, Chung Bang; Park, JH, Smart Structures and Materials 2004 - Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, v.5391, pp.400 - 409, Smart Structures and Materials 2004 - Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 2004-03-15 |
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- 24,275 2020 - 2024
- 75,432 2010 - 2019
- 57,255 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989