Browse "College of Engineering(공과대학)" by Type Conference

Showing results 59321 to 59340 of 91048

59321
Reliability Based Wing Design Optimization Using Trust Region Framework

Ahn, J; Kim, Suwhan; Kwon, Jang-Hyuk, 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, pp.1 - 14, American Institute of Aeronautics and Astronautics, 2004

59322
Reliability Based Wing Design Optimization Using Trust Region-SQP Framework

Kim, S.; Ahn, J.; Kwon, Jang-Hyuk, AIAA/ISSMO Multidisciplinary Analsis and Optimization, 2004

59323
Reliability based wing design optimization using trust-region SQP-framework

Kim, Suwhan; Ahn, Joongki; Kwon, Jang-Hyuk, the10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, 2004-08

59324
Reliability Characteristics of the Thin Interlevel Poly Silicon Oxide for EEPROM Device

Sang-Won Kang, ESC, Extended Abstract, pp.241 -, 1987

59325
Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS)

Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26

59326
Reliability Estimation of Nuclear Digital I&C System using Software Functional Block Diagram and Control Flow

Choi, Jong Gyun; Kang, Hyun Gook; Seong, Tae Yong; Seong, Poong-Hyun, International Symposium on Software Reliability Engineering 2000 (ISSRE2000), 2000-10

59327
Reliability estimation of reduced-order models

Kim, Jin-Gyun; Lee, Phill-Seung, 한국소음진동공학회 2014년 춘계학술대회, 한국소음진동공학회, 2014-04-25

59328
Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09

59329
Reliability Evaluation Methodologies of Fault Tolerant Techniques of Digital I&C Systems in Nuclear Power Plants

KIM, Bo Gyung; KANG, Hyun Gook; LEE, Seung Jun; Seong, Poong-Hyun, ICI 2011 (ISOFIC + CSEPC +ISSNP), 2011-08-23

59330
Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18

59331
Reliability Evaluation of Solder joints in Electronics Packaging

Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002

59332
Reliability Graph with General Gates: An Intuitive and Practical Method for General System Reliability Analysis

Kim, Man Cheol; Seong, Poong-Hyun, The Conference of CUP's Nuclear I&C Subtask, 2002-07

59333
Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29

59334
Reliability Improvement of Charge Trap Flash Memory Cell with Sealing Oxide in Fluorine Incorporation

이승환; 이태윤; 안현준; 이태인; 신의중; 신성원; 조병진, 제26회 한국반도체학술대회, DB하이텍, 한국반도체산업협회, 한국반도체연구조합, 2019-02-14

59335
Reliability Improvement of Experimental Setup with Transparent Windows Visualizing the Two-phase Flow in PEMFC

Lee Dongryul; Bae Joongmyeon, FUCE 2010 (Fuel Cells Science and Technology 2010), Elsevier, 2010-10-06

59336
Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

59337
Reliability improvements of SS7 signaling protocol architecture using ATM technology

Lee, SungWon; Song, Young-Jae; Cho, Dong-Ho, IEEE International Conference on Communications, ICC 1998, pp.1415 - 1419, IEEE, 1998-06

59338
Reliability issues in multi-gate FinFETs

Choi, Yang-Kyu; Han, J.-W.; Lee, H., ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, pp.1101 - 1104, 2006-10-23

59339
Reliability Modeling and Analysis of Catastrophic Failure and Degradation Data

Kim, SH; Kim, DH; Yum, Bong-Jin, International Conference on Industrial Engineering, 2007-11-01

59340
Reliability of Anchor Pile of Offshore Guyed Tower

Yun, Chung Bang, First Pacific/Asia Offshore Mechanics Symposium, v.0, no.0, pp.0 - 0, 1990-06-01

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