Showing results 36101 to 36120 of 91054
High Precision Laser Ranging by Time-of-flight Measurement of Femtosecond Pulses KIM, Young-Jin; Lee, J; Lee, K; Lee, SH; Kim, Seung-Woo, The 5th International Conference on Positioning Technology (ICPT 2012), International Conference on Positioning Technology (ICPT), 2012-11 |
High Precision MBE Growth of Vertical Cavity Surface Emitting Lasers Yoo, Hoi-Jun; Harbinson, J.P.; Florez, L.; Scherer, A.; Chang, C.; Lehman, A. V.; Orenstein, M.; et al, Optical Fiber Conference, 1991 |
High Precision Measurement of 3D Profile Using Confocal Differential Heterodyne Interferometer Gweon, Dae-Gab; Kim, TJ; Lee, SW, 2nd International Symposium on Nano-manufacturing, pp.527 - 529, 2004-11-03 |
High Precision Molding Process for Barrier Ribs of PDP by using a Soft Mold and a Green Sheet Ryu, S.M; Park , L.S.; Yang, Dong-Yol, 7th International Meeting on Information Display, pp.316 - 319, 2007 |
High precision surface-profile metrology by scanning the repetition rate of femtosecond pulses Joo, WD; Kim, YJ; Kim,YS; Park, JY; Kim, Seung-Woo, SPIE 2011 Optics+Photonics, SPIE 2011 Optics+Photonics, 2011-08-21 |
High precision synchronization of a large-scale microwave network over stabilized fiber links W. Wang; A. Kalaydzhyan; K. Shafak; M. Xin; M. Peng; K. Jung; Kim, Jungwon; et al, Conference on Lasers and Electro Optics (CLEO) 2016, OPTICAL SOC AMER, 2016-06-06 |
High Precision X-Y-Theta Micropositioning Stageusing Monolithic Flexure Pivoted Linkages Ryu, J.W.; Gweon, Dae-Gab, ASPE Annual Meeting, pp.626 - 630, 1996-11 |
High Pressure Phase Equilibria for the Carbon Dioxide + 3-Pentanol and Carbon Dioxide + Water + 3-Pentanol Systems Lee, HS; Mun, SY; Lee, Huen, The 5th Asian Thermophysical Properties Conference, pp.547 - 550, 1998-01-01 |
High Pressure Thermal Evaporation-Based Nanoporous Metal Catalysts for CO2 Reduction Ryu, Sangwoo; Oh, Jihun, 2017 MRS Fall Meeting & Exhibit, Material Research Society, 2017-11-29 |
High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies Kim, Seung-Ho; Kim, Young-Jae; Park, Ho Joon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
High pulling rate defect-free crystals with axially asymmetric characteristics due to controlled melt convection Cho, HJ; Lee, BY; Lee, SH; Lee, Jeong Yong, High Purity Silicon 9 - 210th Electrochemical Society Meeting, pp.31 - 39, 2006-10-29 |
HIGH Q VCO USING AN ELECTRO-ACOUSTIC DEVICE COMPATIBLE WITH CMOS INTEGRATED CIRCUIT TECHNOLOGY Choi, pilsoon; Hyun, Seokbong; Eo, Yunseong; Lee, Kwyro, IEEE MTT-S Digest, IEEE, 2000-06 |
High quality bulk heterojunction films formed on a water substrate Lee, Jung-Yong, Global Photovoltaic Conference 2017, Korea Photovoltaic Society, 2017-03-15 |
High quality bulk heterojunction films formed on an water substrate Noh, Jonghyeon; Jeong, Seonju; Lee, Jung-Yong, GPVC 2017, Korea Photovoltaic Society, 2017-03-16 |
High Quality Depth Map Upsampling for 3D-TOF Cameras. Park, Jaesik; Kim, Hyeongwoo; Tai, Yu-Wing; Brown, Michael S.; Kweon, In-So, 13th International Conference on Computer Vision (ICCV2011), pp.1623 - 1630, IEEE Computer Society and the Computer Vision Foundation (CVF), 2011-11 |
High quality graphene synthesis and its application to high performance electronic devices Cho, Byung Jin, The 8th International Conference on Advanced Materials and Devices (ICAMD 2013), The Korean Physical Society, 2013-12-12 |
High quality Microcrystalline Silicon-Carbide Films Prepared by Photo-CVD Method Using Ethylene Gas as a Carbon source Myong, SY; Lee, HK; Yoon, E; Lim, Koeng Su, MRS Spring Meeting, MRS, 1999-01-01 |
High Quality Multi-Walled Carbon Nanotubes from Catalytic Decomposition of Carbo Sources Kim, Sang Done, FLUIDIZATION XII, pp.35 - 36, 2007 |
High Quality N+/P Junction of Ge Substrate Prepared by initiated CVD Doping Process Kim, Jae Hwan; Shin, Sung Won; Lee, Tae In; Hwang, Wan Sik; Cho, Byung-Jin, 2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020, Institute of Electrical and Electronics Engineers Inc., 2020-06-19 |
High Quality RF Passive Integration using 35 um Thick Oxide Manufacturing Technology Kwon, Young Se, ECTC, pp.1007 - 1011, 2002 |
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