Browse "College of Engineering(공과대학)" by Type Conference

Showing results 65381 to 65400 of 90929

65381
Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications

Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01

65382
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

65383
Studies on the Interfacial Tensions of Liquid Metal-Fluid Systems

류가빈; 김형수, 재 12회 한국유체공학학술대회, 한국전산유체공학회, 2022-06-23

65384
Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers

Sang-Won Kang, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991

65385
Studies on the modification of Epoxy resin with polydimethylsiloxane

Kim, Sung Chul, 36th IUPAC international symposium on macromolecules, 1996

65386
Studies on the Surface Morphology of BCB films by Plasma Ions

Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01

65387
Studies on the synthesis of mesoporous molecular sieves, MCM-41 and its potential applicability to hydrotreating catalyst system

김충현; 홍석봉; 우성일, 한국화학공학회 춘계학술발표회, pp.963 -, 한국화학공학회, 1995-04

65388
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09

65389
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27

65390
Studies on thin film integral passive components for mixed mode multichip module (MCM) applications

Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04

65391
Studies on various 2-metal chip-on-flex (COF) packaging methods

Suk, KL; Kim, JS; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1125 - 1131, ECTC, 2010-06-01

65392
STUDIES RELEVANT TO IN-VESSEL STEAM EXPLOSIONS

Yang, Ji-Won, 4TH INT. TOPICAL MTGON NUCLEAR REACTOR THERMAL-HYDRAULICS, pp.10 - 13, 1989-10-01

65393
(studio-projects) Mirror Mirror: An On-Body Clothing Design System

Saakes, Daniel Pieter; Hui-Shyong Yeo; Seung-Tak Noh; Han Gyeol; Woo, Woon-Tack, The 42nd International Conference and Exhibition on Computer Graphics and Interactive Techniques, ACM Special Interest Group on Computer Graphics and Interactive Techniques (SIGGRAPH), 2015-08-13

65394
(studio-talks) Mirror Mirror: An On-body Clothing Design System

Saakes, Daniel Pieter; Yeo, Hui Shyong; Noh, Seun Tak; Han, Gyeol; Woo, Woon-Tack, The 42nd International Conference and Exhibition on Computer Graphics and Interactive Techniques, ACM Special Interest Group on Computer Graphics and Interactive Techniques (SIGGRAPH), 2015-08-12

65395
Study about Catalytic performance of CuO/CGO for Preferential Oxidation in Hydrogen Reforming

오지우; 배중면, KIChE 2012 Spring meeting, KIChE, 2012-04

65396
Study about New top-down method to fabricate complex 3-D nanoparticles by using SSL(Secondary Scattering Lithography)

김종선; 전환진; 백연경; 김경환; 김대우; Jung, HeeTae, The 24th International Symposium on Cheical Engineering, 2011-12

65397
Study about the effect of gadolinium doped ceria as support material for copper oxide to remove carbon monoxide in hydrogen rich stream

Oh, Jiwoo; Bae, Joongmyeon, 248th American Chemical Society National Meeting & Exposition, American Chemical Society, 2014-08-11

65398
Study about the reliability of sensors in motion perception using Kalman filter

Lim, Hyerim; Park, Sukyung, International Symposium on Nature-Inspired Technology, KSME, KIMM, KIST, 2013-01-06

65399
Study by Thermal Analysis and Atmosphere Effect of Bi-Sr-Ca-Cu-O system by Electrical Conductivity

김호기, The Korean Ceramic Society, fall meeting, Seoul Univ., 1988

65400
Study for Acoustic characteristics change of Metasurface having patterned electrode based on Dielectric Elastomer Actuators

KIM, JONGNAM; Jun, Kiwoo; Oh, Il-Kwon, CAVNC 2018 (int'l Conference on Acoustics, Vibration and Noise Control), International Conference on Acoustics, Vibration and Noise Control, 2018-01-14

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