Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구Fabrication and Characteristics of Electroless Ni Bump for Flip Chip Interconnection
- Publisher
- 한국재료학회
- Issue Date
- 1999-11
- Language
- Korean
- Citation
한국재료학회지, v.9, no.11, pp.1095 - 1101
- ISSN
- 1225-0562
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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