Effect of Non-conducting filler additions on Anisotropic Conductive Adhesive(ACAs) properties and reliability of ACAs flip-chip on organic substrates
- Publisher
- 한국재료학회
- Issue Date
- 2000-03
- Language
- Korean
- Citation
한국재료학회지, v.10, no.3, pp.184 - 190
- ISSN
- 1225-0562
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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