반도체패키지 구성요소의 재료물성가치와 기하학적 형상이 여러형태의 패키지균열에 미치는 영향에 대한 파괴학적 연구A Fracture Mmechanics Analysis of the Material Properties and Geometries of Components on Various Types of Package Cracks
- Publisher
- 대한기계학회
- Issue Date
- 1995-01
- Language
- Korean
- Citation
대한기계학회논문집, v.19, pp.3270 - 3280
- ISSN
- 1226-4873
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.