반도체 패키지 구성요소의 재료물성치와 기하학적 형상이 여러형태의 패키지균열에 미치는 영향에 대한 파괴역학적 연구A Fracture Mechanics Analysis of Effects of Material Prooerties and Geometries of Components on Various Types of Package Cracks
- Publisher
- 대한기계학회
- Issue Date
- 1995
- Language
- Korean
- Citation
대한기계학회논문집, v.19, pp.3270 - 3280
- ISSN
- 1226-4873
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.