Results 1-1 of 1 (Search time: 0.152 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
---|---|
Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine Kim, JS; Huh, Hoon, EXPERIMENTAL MECHANICS, v.51, no.6, pp.845 - 855, 2011-07 |
Discover