Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine

Abstract

The material properties of an oxygen-free high thermal conductivity (OFHC) film with a thickness of 0.1 mm were evaluated at strain rates ranging from 10(-3)/s to 10(3)/s using a high-speed material micro-testing machine (HSMMTM). The high strain-rate material properties of thin films are important especially for an evaluation of the structural reliability of micro-formed parts and MEMS products. The high strain-rate material testing methods of thin films, however, have yet to be established to the point that the testing methods of larger specimens for electronics, auto-body, train, ship, and ocean structures are. For evaluation, a new type of HSMMTM was developed to conduct high-speed tensile tests of thin films. This machine is capable of testing at a sufficiently high tensile speed with an electromagnetic actuator, a novel gripping mechanism, and an accurate load measurement system. The OFHC copper film shows high strain-rate sensitivity in terms of the flow stress, fracture elongation, and strain hardening. These measures increase as the tensile strain rate increases. The rate-dependent material properties of an OFHC copper film are also compared with those of a bulk OFHC copper sheet with a thickness of 1 mm. The flow stress of an OFHC copper film is relatively low compared to that of a bulk OFHC copper sheet in the entire range of strain rates, while the fracture elongation of an OFHC copper film is much larger than that of a bulk OFHC copper sheet. A quantitative comparison would provide material data at high strain rates for the design and analysis of micro-appliances and different types of micro-equipment.