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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 | |
| Synergistic enhancement and mechanism study of mechanical and moisture stability of perovskite solar cells introducing polyethylene-imine into the CH3NH3PbI3/HTM interface Yun, Jae Hoon; Lee, Inhwa; Kim, Taek-Soo; Ko, Min Jae; Kim, Jin Young; Son, Hae Jung, JOURNAL OF MATERIALS CHEMISTRY A, v.3, no.44, pp.22176 - 22182, 2015-09 | |
| Adhesion improvement of graphene/copper interface using UV/ozone treatments Seo, Jeongmin; Chang, Won Seok; Kim, Taek-Soo, THIN SOLID FILMS, v.584, pp.170 - 175, 2015-06 | |
| Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 | |
| Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings Park, Jung Hwan; Seo, Jeongmin; Kim, Cheolgyu; Joe, Daniel Juhyung; Lee, Han Eol; Im, Tae Hong; Seok, Jae Young; Jeong, Chang Kyu; Ma, Boo Soo; Park, Hyung Kun; Kim, Taek-Soo; Lee, Keon Jae, ADVANCED SCIENCE, v.5, no.11, pp.1801146, 2018-10 | |
| Flexural and tensile moduli of flexible FR4 substrates Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.53, pp.70 - 76, 2016-08 | |
| Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films Kim, Jae Han; Noh, Jonghyeon; Choi, Hyesun; Lee, Jung-Yong; Kim, Taek-Soo, CHEMISTRY OF MATERIALS, v.29, no.9, pp.3954 - 3961, 2017-05 | |
| Tensile testing of ultra-thin films on water surface Kim, Jae-Han; Nizami, Adeel; Hwangbo, Yun; Jang, Bongkyun; Lee, Hak-Joo; Woo, Chang-Su; Hyun, Seungmin; Kim, Taek-Soo, NATURE COMMUNICATIONS, v.4, 2013-10 |
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