Browse "ME-Journal Papers(저널논문)" by Type Article
Showing results 6081 to 6100 of 12333
| Mathematical modelling of rotational arc sensor in GMAW and its applications to seam tracking and endpoint detection Shi, Y. H.; Yoo, W. S.; Na, Suck-Joo, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.11, no.6, pp.723 - 730, 2006-11 |
| Matrix stiffness induces epithelial mesenchymal transition phenotypes of human epidermal keratinocytes on collagen coated two dimensional cell culture Kim, Mina; Gweon, Bomi; Koh, Unghyun; Cho, Youngbin; Shin, Dong Wook; Noh, Minsoo; Shin, Jennifer Hyunjong, BIOMEDICAL ENGINEERING LETTERS, v.5, no.3, pp.194 - 202, 2015-09 |
| Maximum plasmon thermal conductivity of a thin metal film Yun, Kuk Hyun; Kim, Dong-min; Lee, Bong Jae, PHYSICAL REVIEW B, v.109, no.16, 2024-04 |
| MAXIMUM POWER-CONVERSION EFFICIENCY FOR THE UTILIZATION OF SOLAR-ENERGY LEE, WY; Kim, Sang Soo, INTERNATIONAL JOURNAL OF ENERGY RESEARCH, v.15, no.4, pp.257 - 267, 1991 |
| Maximum spreading of a shear-thinning liquid drop impacting on dry solid surfaces An, Sang-Mo; Lee, Sang-Yong, EXPERIMENTAL THERMAL AND FLUID SCIENCE, v.38, pp.140 - 148, 2012-04 |
| Maximum spreading of electrically charged droplets impacting on dielectric substrates Lee, Sang Yong; Ryu, Sung Uk, INTERNATIONAL JOURNAL OF MULTIPHASE FLOW, v.35, no.1, pp.1 - 7, 2009-01 |
| MEAN-FLOW MEASUREMENTS IN THE THREE-DIMENSIONAL BOUNDARY LAYER OVER A BODY OF REVOLUTION AT INCIDENCE. Ramaprian, B.R.; Patel, V.C.; Choi, Do Hyung, JOURNAL OF FLUID MECHANICS, v.103, no.0, pp.479 - 504, 1981-02 |
| Measuerment Signal Selection and a Simultaneous State and Input Observer Stein J. L.; Park, Youngjin, JOURNAL OF DYNAMIC SYSTEMS MEASUREMENT AND CONTROL-TRANSACTIONS OF THE ASME, v.110, no.2, pp.166 - 173, 1988-06 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| MEASUREMENT AND ANALYSIS OF HEAT-TRANSFER AND FRICTION DURING HOT-FORGING Burte, P.R.; Im, Yong-Taek; Altan, T.; Semiatin, S.L., JOURNAL OF ENGINEERING FOR INDUSTRY-TRANSACTIONS OF THE ASME, v.112, no.4, pp.332 - 339, 1990-11 |
| Measurement and characterization of soft tissue behavior with surface deformation and force response under large deformations Ahn, Bum-Mo; Kim, Jung, MEDICAL IMAGE ANALYSIS, v.14, no.2, pp.138 - 148, 2010-04 |
| Measurement and Characterization of the Moisture-Induced Properties of ACF Package Yoon, Ji-Young; Kim, Ilho; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.131, no.2, pp.0210121 - 0210128, 2009-06 |
| Measurement and prediction of thermal errors of a CNC machining center using two spherical balls Yang, Min-Yang; Lee, JJ, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.75, no.1-3, pp.180 - 189, 1998-03 |
| Measurement and restoration of the point spread function of fluorescence confocal microscopy Yoo, Hongki; Song, Incheon; Gweon, Dae-Gab, JOURNAL OF MICROSCOPY, v.221, no.3, pp.172 - 176, 2006-03 |
| Measurement devices for piston assembly friction and oil film thickness Cho, SW; Choi, Sangmin; Bae, CS, INTERNATIONAL JOURNAL OF VEHICLE DESIGN, v.29, no.4, pp.390 - 402, 2002 |
| Measurement method for fine 6-DOF displacement of rigid bodies W.S. Park; HyunhSuck Cho, 제어.로봇.시스템학회 논문지, v.8, no.3, pp.208 - 219, 2002 |
| Measurement of acoustic impedance and prediction of transmission loss of the porous woven hose in engine intake systems Park, CM; Ih, Jeong-Guon; Nakayama, Y; Kitahara, S, APPLIED ACOUSTICS, v.63, no.7, pp.775 - 794, 2002-07 |
| Measurement of Acoustic Source Characteristic of Engine Intake System and Prediction of Engine Intake Mouth Noise Nishiuchi, S; Shinoda, K; Kim, HJ; Lee, SH; Ih, Jeong-Guon, TRANSACTIONS OF THE JAPANESE SOCIETY OF AUTOMOTIVE ENGINEERS (JSAE TRANSACTIONS), v.36, no.5, pp.169 - 173, 2005-09 |
Measurement of an analyte concentration in test solution by using Helmholtz resonator for biosensor applications Chen, Yugang; Park, Yong-Hwa, SENSORS, v.19, no.5, pp.1 - 9, 2019-03 |
| Measurement of creep and relaxation behaviors of wafer-level CSP assembly using Moire interferometry Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.125, pp.282 - 288, 2003-06 |
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