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Browse "ME-Journal Papers(저널논문)" by Subject wafer-level

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1	Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Don; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06

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