Browse "ME-Journal Papers(저널논문)" by Author Kim, Youson
Showing results 1 to 3 of 3
| A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures Jeong, Kihoon; Kim, Dohun; AHN, DAHYE; Yang, Chanhee; Kim, Junmo; Lee, ChangHyeon; Kim, Youson; et al, CHEMICAL ENGINEERING JOURNAL, v.480, 2024-01 |
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; et al, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 |
| A Sub-Micron-Thick stretchable adhesive layer for the lamination of arbitrary elastomeric substrates with enhanced adhesion stability Jeong, Kihoon; Lee, Yujin; Kim, Youson; Mun, Hyeonwoo; Kyung, Ki-Uk; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.429, pp.132250, 2022-02 |
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