Browse "ME-Journal Papers(저널논문)" by Author Ham, SJ
Showing results 1 to 4 of 4
| Experimental study for reliability of electronic packaging under vibration Ham, SJ; Lee, Soon-Bok, EXPERIMENTAL MECHANICS, v.36, no.4, pp.339 - 344, 1996-12 |
| Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10 |
| Measurement of creep and relaxation behaviors of wafer-level CSP assembly using Moire interferometry Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.125, pp.282 - 288, 2003-06 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
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