Experimental study for reliability of electronic packaging under vibration

Abstract

An automated fatigue-testing system was developed for an experimental study on the integrity of the electronic packaging subjected to mechanical vibration. The fatigue-testing machine utilized the electromagnetic device as an actuator. A data acquisition system was developed for the fatigue test of the electronic board, The fixture for the specimen was designed to be suitable for measuring the fatigue life of a typical module/lead/card electronic system subjected to vibration. With this automated fatigue-testing machine, the mechanical integrity of surface mount component with the spider gullwing leads has been studied by a mechanical flexural fatigue test. An experimental method was developed to measure the changes in electrical resistance in the lead, which is used to indicate a fatigue failure. Finally, a relationship between the loading force and the fatigue life of high-cycle region was discussed for the lead of spider gullwing type surface-mounted component, With the relation, the fatigue life of the surface-mounted component (SMC) subjected to vibration environment was predicted successfully.