Showing results 18 to 19 of 19
Silicon wafer crack detection using nonlinear ultrasonic modulation induced by high repetition rate pulse laser Jang, Jinho; Liu, Peipei; Kim, Byunggi; Kim, Seung-woo; Sohn, Hoon, OPTICS AND LASERS IN ENGINEERING, v.129, 2020-06 |
Three-dimensional machining of carbon nanotube forests using water-assisted scanning electron microscope processing Rajabifar, Bahram; Kim, Sanha; Slinker, Keith; Ehlert, Gregory J.; Hart, A. John; Maschmann, Matthew R., APPLIED PHYSICS LETTERS, v.107, no.14, 2015-10 |
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