Browse "ME-Journal Papers(저널논문)" by Type Article
Showing results 9041 to 9060 of 12100
| Thermomechanical analyses of laser precision joining for optoelectronic components Chang, WS; Na, Suck-Joo, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.2, pp.349 - 358, 2003-06 |
| Thermomechanical Behavior of Poly(3-hexylthiophene) Thin Films on the Water Surface Ma, Boo Soo; Lee, Jin-Woo; Park, Hyeonjung; Kim, Bumjoon J.; Kim, Taek-Soo, ACS OMEGA, v.7, no.23, pp.19706 - 19713, 2022-06 |
| Thermomechanical fatigue behavior of the ferritic stainless steel Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005 |
| Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
| Thermophoresis in the cryogenic temperature range Lee, BU; Kim, Sang Soo, JOURNAL OF AEROSOL SCIENCE, v.32, no.1, pp.107 - 119, 2001-01 |
| THERMOPHORESIS OF HIGHLY ABSORBING, EMITTING PARTICLES IN LAMINAR TUBE FLOW YOA, SJ; Kim, Sang Soo; LEE, JS, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.11, no.2, pp.98 - 104, 1990-06 |
| THERMOPHORETIC DEPOSITION OF ABSORBING, EMITTING AND ISOTROPICALLY SCATTERING PARTICLES IN LAMINAR TUBE FLOW WITH HIGH PARTICLE MASS LOADING PARK, SUNG HO; Kim, Sang Soo, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.36, no.14, pp.3477 - 3485, 1993-09 |
| Thermophoretic transport and deposition of particles in vertical tube flow with variable wall temperature and thermal radiation Park, SH; Kim, WJ; Kim, Sang Soo, KSME INTERNATIONAL JOURNAL, v.13, no.3, pp.253 - 263, 1999-03 |
| Thermophotonic cells in self-sustaining parallel circuits Yang, Zhimin; Song, Jaeman; Lee, Bong Jae, JOURNAL OF QUANTITATIVE SPECTROSCOPY & RADIATIVE TRANSFER, v.312, 2024-01 |
| Thermophotovoltaic Energy Conversion in Far-to-Near-Field Transition Regime Song, Jaeman; Jang, Junho; Lim, Mikyung; Choi, Minwoo; Lee, Jungchul; Lee, Bong Jae, ACS PHOTONICS, v.9, no.5, pp.1748 - 1756, 2022-05 |
| Thermopiezoelastic nonlinear dynamics of active piezolaminated plates Oh, Il-Kwon, SMART MATERIALS & STRUCTURES, v.14, no.4, pp.823 - 834, 2005-08 |
| Thermopiezoelastic snapping of piezolaminated plates using layerwise nonlinear finite elements Oh, Il-Kwon; Han, Jae-Hung; Lee, In, AIAA JOURNAL, v.39, no.6, pp.1188 - 1197, 2001-06 |
| Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
| Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
| THERMOVISCOPLASTIC ANALYSIS OF HYPERSONIC STRUCTURES SUBJECTED TO SEVERE AERODYNAMIC HEATING Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, JOURNAL OF AIRCRAFT, v.27, no.9, pp.826 - 835, 1990-09 |
| Thickness minimized magnetic circuit for rotary-type voice coil motor Jeong, JH; Lee, JH; Yoon, HK; Gweon, Dae-Gab, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.44, no.3, pp.1262 - 1263, 2005-03 |
| Thickness-profile measurement of transparent thin-film layers by white-light scanning interferometry Kim, Seung-Woo; Kim, GH, APPLIED OPTICS, v.38, no.28, pp.5968 - 5973, 1999-10 |
| Thin film display based on polymer waveguides Park, Suntak; Park, Bong Je; Yun, Sungryul; Nam, Saekwang; Park, Seung Koo; Kyung, Ki-Uk, OPTICS EXPRESS, v.22, no.19, pp.23433 - 23438, 2014-09 |
| Thin-film thickness profile and its refractive index measurements by dispersive white-light interferometry Ghim, Young-Sik; Kim, Seung-Woo, OPTICS EXPRESS, v.14, no.24, pp.11885 - 11891, 2006-11 |
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