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Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation Yeap, K.B.; Hangen, U; Ritz, Y; Kim, Taek-Soo; Dauskardt, R.H.; Zschech, E, Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop, pp.159 - 165, Proceedings of Stress-Induced Phenomena in Metallization, 2010-01-01 |
Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Zhong, Q; Peterson, M; Tam, H; Konno, T; Dauskardt, R.H., Materials Research Society 2008 Spring Meeting, Materials Research Society, 2008-03-24 |
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