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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of substrate bias voltage on plasma parameters in temperature control using a grid system Bai, KH; Hong, JI; You, SJ; Chang, Hong-Young, PHYSICS OF PLASMAS, v.8, no.9, pp.4246 - 4250, 2001-09 | |
| On inductively coupled plasmas for next-generation processing Lee, YK; Lee, DS; Bai, KH; Chung, CW; Chang, Hong-Young, SURFACE COATINGS TECHNOLOGY, v.169, pp.20 - 23, 2003-06 | |
| Control of ion species in inductively coupled oxidation plasma by inert gas mixing Bai, KH; Chang, Hong-Young, JOURNAL OF APPLIED PHYSICS, v.100, pp.443 - 448, 2006-12 | |
| Study on the mode transitions for rf power dissipation in capacitively coupled plasma You, SJ; Ahn, SK; Chang, Hong-Young, SURFACE & COATINGS TECHNOLOGY, v.193, pp.81 - 87, 2005-04 | |
| Highly selective SiO2 etching in low-electron-temperature inductively coupled plasma Bai, KH; Chang, Hong-Young; Kwon, GC; Kim, HS; Kim, JS, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, pp.3602 - 3604, 2007-06 | |
| Temporal evolution of electron energy distribution function and plasma parameters in the afterglow of drifting magnetron plasma Seo, SH; In, JH; Chang, Hong-Young, PLASMA SOURCES SCIENCE & TECHNOLOGY, v.14, pp.576 - 580, 2005-08 | |
| Pressure and helium mixing effects on plasma parameters in temperature control using a grid system Bai, KH; Hong, JI; Chung, CW; Kim, SS; Chang, Hong-Young, PHYSICS OF PLASMAS, v.8, no.7, pp.3498 - 3501, 2001-07 | |
| Si etching rate calculation for low pressure high density plasma source using Cl-2 gas Lee, YD; Chang, Hong-Young; Chang, Choong-Seock, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.18, no.5, pp.2224 - 2229, 2000 | |
| Electron temperature analysis of two-gas-species inductively coupled plasma Bai, KH; Chang, Hong-Young; Uhm, HS, APPLIED PHYSICS LETTERS, v.79, no.11, pp.1596 - 1598, 2001-09 | |
| Power dissipation mode transition by a magnetic field You, SJ; Chung, CW; Bai, KH; Chang, Hong-Young, APPLIED PHYSICS LETTERS, v.81, no.14, pp.2529 - 2531, 2002-09 |
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