Designing an Advanced Copper-Alloy Leadframe Material
- Publisher
- Reed Business
- Issue Date
- 1985-04
- Language
- English
- Citation
SEMICONDUCTOR INTERNATIONAL, v.8, no.4, pp.250 - 253
- ISSN
- 0163-3767
- Appears in Collection
- RIMS Journal Papers
- Files in This Item
- There are no files associated with this item.
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