Designing an Advanced Copper-Alloy Leadframe Material
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | y.g. kim | ko |
| dc.contributor.author | c. ryu | ko |
| dc.date.accessioned | 2013-02-25T09:33:15Z | - |
| dc.date.available | 2013-02-25T09:33:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1985-04 | - |
| dc.identifier.citation | SEMICONDUCTOR INTERNATIONAL, v.8, no.4, pp.250 - 253 | - |
| dc.identifier.issn | 0163-3767 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/61215 | - |
| dc.language | English | - |
| dc.publisher | Reed Business | - |
| dc.title | Designing an Advanced Copper-Alloy Leadframe Material | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 8 | - |
| dc.citation.issue | 4 | - |
| dc.citation.beginningpage | 250 | - |
| dc.citation.endingpage | 253 | - |
| dc.citation.publicationname | SEMICONDUCTOR INTERNATIONAL | - |
| dc.contributor.localauthor | y.g. kim | - |
| dc.contributor.nonIdAuthor | c. ryu | - |
- Appears in Collection
- RIMS Journal Papers
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.