Browse "MS-Journal Papers(저널논문)" by Subject wafer-level package
Showing results 1 to 2 of 2
| Review of Electrically Conductive Adhesive Technologies for Electronic Packaging Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.183 - 194, 2006-12 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
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