Browse "MS-Journal Papers(저널논문)" by Type Article

Showing results 5001 to 5020 of 7225

5001
Piezoelectric properties of lead zirconate titanate thin films characterized by the pneumatic loading method

Kim, DG; Kim, Ho Gi, INTEGRATED FERROELECTRICS, v.24, no.1-4, pp.107 - 119, 1999

5002
Piezoelectric Properties on the Thickness of Specimens with PZT/Epoxy Composite Materials of 1-3 Connectivity

Y.H. Kim; J.S. Kim; D.C. Lee; H.G. Kim, 한국세라믹학회지, v.25, no.1, pp.7 - 14, 1988

5003
Piezoelectrically and Topographically Engineered Scaffolds for Accelerating Bone Regeneration

Soyun Joo; Gwon Yonghyun; Kim Soyeon; Park Sunho; Kim Jangho; Hong Seungbum, ACS APPLIED MATERIALS & INTERFACES, v.16, no.2, pp.1999 - 2011, 2024-01

5004
Piezoresponse force microscopy studies of PbTiO3 thin films grown via layer-by-layer gas phase reaction

Park, Moon-Kyu; Hong, Daniel Seungbum; Kim, Ji-Yoon; Kim, Yun-Seok; Buehlmann, Simon; Kim, Yong-Kwan; No, Kwang-Soo, APPLIED PHYSICS LETTERS, v.94, no.9, 2009-03

5005
Pinning enhancement and critical current densities in (Sm0.5Y0.5)Ba2Cu3O7-x superconductor

Kim, Ho-Gi; Lee, Kyu-Won; Kim, Jin-Tae; Ha, Dong-Han; Park, Yong-Ki; Park, Jong-Chul; Kim, So-Jung, IEEE TRANSACTIONS ON MAGNETICS, v.35, no.5, pp.4076 - 4078, 1999-01

5006
Pitfalls and Protocols: Evaluating Catalysts for CO2 Reduction in Electrolyzers Based on Gas Diffusion Electrodes

Tan, Ying Chuan; Quek, Wei Kang; Kim, Beomil; Sugiarto, Sigit; Oh, Jihun; Kai, Dan, ACS ENERGY LETTERS, v.7, no.6, pp.2012 - 2023, 2022-06

5007
Pitting corrosion of the laser surface melted Alloy 600

Lim, YS; Kim, JS; Kwon, Hyuk-Sang, JOURNAL OF NUCLEAR MATERIALS, v.336, pp.65 - 72, 2005-01

5008
PITTING RESISTANCE AND MECHANISM OF TIN-COATED INCONEL-600 IN 100-DEGREES-C NACL SOLUTION

IN, CB; KIM, YI; KIM, JS; CHUN, SS; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.224, no.1, pp.71 - 78, 1995-07

5009
PITTING RESISTANCE OF TIN DEPOSITED ON INCONEL-600 BY PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION

In, C.B.; Kim, S.P.; Kim, Y.I.; Kim, W.W.; Kuk, I.H.; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.211, no.3, pp.223 - 230, 1994

5010
Plane strain compression of single crystalline Ni3Al-base intermetallic compounds

Song, SH; Kishida, K; Demura, M; Oh, MH; Wee, Dang-Moon; Hirano, T, ICOTOM 14: TEXTURES OF MATERIALS, PTS 1AND 2 BOOK SERIES: MATERIALS SCIENCE FORUM, v.495-497, pp.772 - 12, 2005

5011
Plasma doping technology for fabrication of nanoscale metal-oxide-semiconductor devices

Cho, Won-ju; Im, Kiju; Ahn, Chang-Geun; Yang, Jong-Heon; Oh, Jihun; Baek, In-Bok; Lee, Seongjae, Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, v.22, no.6, pp.3210 - 3213, 2004-11

5012
Plasma enhanced chemically vapor deposited aluminum oxide films as a new etch mask material for microelectronic fabrication

이원종, KOREAN APPLIED PHYSICS, v.7, no.4, pp.289 - 296, 1994-04

5013
Plasma Sintering of Al2O3-B4C Composite

Kim, Do Kyung; Moon, YT; Kim, WJ; Kim, CH, JOURNAL OF MATERIALS SYNTHESIS AND PROCESSING, v.3, no.2, pp.115 - 120, 1995-04

5014
Plasma- mediated fabrication of ultrathin NiAl nanosheets having rich oxygen vacancies and doped nitrogen sites and their utilization for high activity and robust stability in photoelectrochemical water oxidation

Kim, Keon-Han; Choi, Jae Won; Lee, Heebin; Moon, Byeong Cheul; Park, Dong Gyu; Choi, Won Ho; Kang, Jeung Ku, JOURNAL OF MATERIALS CHEMISTRY A, v.6, no.46, pp.23283 - 23288, 2018-12

5015
Plasma-assisted molecular beam epitaxy of In xGa 1-XN films on: C-plane sapphire substrates

Shin, EunJung; Seok, LimDong; Lim, SeHwan; Han, SeokKyu; Lee, HyoSung; Hong, SoonKu; Joeng, Myoungho; et al, Korean Journal of Materials Research, v.22, no.4, pp.185 - 189, 2012-04

5016
Plasma-assisted molecular-beam epitaxy of ZnO films on (0001) Al2O3: Effects of the MgO buffer layer thickness

Kim, Jae Goo; Han, Seok Kyu; Kang, Dong-Suk; Yang, Sang Mo; Hong, Soon-Ku; Lee, Jae Wook; Lee, Jeong Yong; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.53, no.1, pp.271 - 275, 2008-07

5017
Plasma-enhanced ALD of titanium-silicon-nitride using TiCl4, SiH4, and N-2/H-2/Ar plasma

Park, JS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.8, pp.C87 - C89, 2004

5018
Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals

Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006

5019
Plasma-enhanced atomic layer deposition of ruthenium thin films

Kwon, OK; Kwon, SH; Park, HS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.4, pp.C46 - C48, 2004

5020
Plasma-enhanced atomic layer deposition of Ta-N thin films

Park, JS; Park, HS; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.1, pp.28 - 32, 2002-01

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