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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 | |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 | |
| Interface Circuit for Three-Electrode Metal-Oxide (MOX) Gas Sensor Park, Jeong-Ho; Park, Kwang-Min; Kim, Tae-Wan; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE Sensors 2015, pp.1279 - 1282, IEEE, 2015-11-03 | |
| Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection Yoon, Dal Jin; Paik, Kyung-Wook, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.1113 - 1116, John Wiley and Sons Inc, 2018-05 | |
| Interfacial perpendicular magnetic anisotropy in CoFeB/MgO structure with various underlayers Oh, Young-wan; Lee, Kyeong-dong; Jeong, Jong-yul; Park, Byong Guk, 58th annual conference on magneitsm and magnetic materials, American Institute of Physics, 2013-11-05 | |
| Flexible Mutual-capacitive Fingerprint Sensor with Hard and Flexible Overlaid Dielectric Layer for Biometrics Application Lee, Seung Hee; Jeon, Guk-Jin; Kim, Yong Ho; Kang, Il-Suk; Kim, Hongchae; Bae, Byeong-Soo; Park, Sang-Hee Ko, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.87 - 89, John Wiley and Sons Inc, 2018-05 | |
| Effects of Film Viscosity on Electric Field-induced Alignment of Graphene flakes in B-stage Graphene-epoxy Composite Films Jung, Seung-Yoon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-29 | |
| Plasma-etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection Lee, Sang Hoon; Kim, Tae Wan; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 | |
| Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kim, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1024 - 1030, The 63rd Electronic Components and Technology Conference, 2013-05-30 | |
| Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies Kim, Seung-Ho; Choi, Yongwon; Kim, Yoosun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1713 - 1716, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
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